A domain decomposition method for the simulation of fracture in polysilicon MEMS

To overcome the computational burden associated to the three-dimensional finite element simulation of fracture phenomena in polysilicon MEMS during dynamic loading, like e.g. impacts, a domain decomposition technique is used. The approach extends a method developed for linear elastic materials, by i...

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 53; no. 8; pp. 1045 - 1054
Main Authors Confalonieri, Federica, Cocchetti, Giuseppe, Ghisi, Aldo, Corigliano, Alberto
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.08.2013
Subjects
Computer simulation
Construction equipment
Crack initiation
Crack propagation
Fracture mechanics
Loads (forces)
Three dimensional
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ISSN0026-2714
1872-941X
DOI10.1016/j.microrel.2013.02.021

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Summary:To overcome the computational burden associated to the three-dimensional finite element simulation of fracture phenomena in polysilicon MEMS during dynamic loading, like e.g. impacts, a domain decomposition technique is used. The approach extends a method developed for linear elastic materials, by including cohesive crack propagation and it allows for the simulation of inter and trans-granular fracture initiation and propagation in polycrystals and it is a step forward in the construction of a complete simulation tool for the description of fracture phenomena in microsystems. Applications to critical MEMS details show encouraging results in reproducing local failure mechanisms.
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ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2013.02.021