APA (7th ed.) Citation

Jeong, S., Shin, Y., Kwack, W., Lee, H. W., Jeong, Y., Kim, D., . . . Kwon, S. (2011). Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer. Surface & coatings technology, 205(21), 5009-5013. https://doi.org/10.1016/j.surfcoat.2011.04.094

Chicago Style (17th ed.) Citation

Jeong, Seong-Jun, Yu-Ri Shin, Won-Sub Kwack, Hyung Woo Lee, Young-Keun Jeong, Doo-In Kim, Hyun Chang Kim, and Se-Hun Kwon. "Plasma-enhanced Atomic Layer Deposition of Ir Thin Films for Copper Adhesion Layer." Surface & Coatings Technology 205, no. 21 (2011): 5009-5013. https://doi.org/10.1016/j.surfcoat.2011.04.094.

MLA (9th ed.) Citation

Jeong, Seong-Jun, et al. "Plasma-enhanced Atomic Layer Deposition of Ir Thin Films for Copper Adhesion Layer." Surface & Coatings Technology, vol. 205, no. 21, 2011, pp. 5009-5013, https://doi.org/10.1016/j.surfcoat.2011.04.094.