Adaptive inter-layer message routing in 3D networks-on-chip

► We present an adaptive algorithm for message routing in 3D networks-on-chip. ► The 3D NoC stack can be heterogeneous and have partial vertical connectivity. ► Specific 2D routing algorithm can be used inside each 2D layer of the 3D stack. ► The 3D routing algorithm ensures fast local reconfigurati...

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Published inMicroprocessors and microsystems Vol. 35; no. 7; pp. 613 - 631
Main Authors Rusu, Claudia, Anghel, Lorena, Avresky, Dimiter
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.10.2011
Elsevier
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ISSN0141-9331
1872-9436
DOI10.1016/j.micpro.2011.06.008

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Summary:► We present an adaptive algorithm for message routing in 3D networks-on-chip. ► The 3D NoC stack can be heterogeneous and have partial vertical connectivity. ► Specific 2D routing algorithm can be used inside each 2D layer of the 3D stack. ► The 3D routing algorithm ensures fast local reconfiguration after failures. ► The algorithm avoids congestions by adapting to NoC topology and runtime load. Existing routing algorithms for 3D deal with regular mesh/torus 3D topologies. Today 3D NoCs are quite irregular, especially those with heterogeneous layers. In this paper, we present a routing algorithm targeting 3D networks-on-chip (NoCs) with incomplete sets of vertical links between adjacent layers. The routing algorithm tolerates multiple link and node failures, in the case of absence of NoC partitioning. In addition, it deals with congestion. The routing algorithm for 3D NoCs preserves the deadlock-free propriety of the chosen 2D routing algorithms. It is also scalable and supports a local reconfiguration that complements the reconfiguration of the 2D routing algorithms in case of failures of nodes or links. The algorithm incurs a small overhead in terms of exchanged messages for reconfiguration and does not introduce significant additional complexity in the routers. Theoretical analysis of the 3D routing algorithm is provided and validated by simulations for different traffic loads and failure rates.
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ISSN:0141-9331
1872-9436
DOI:10.1016/j.micpro.2011.06.008