Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism - Dudek, R.; Berek, H.; Fritsch, T.; Michel, B. (IEEE transactions on components and packaging technologies, 2000)
Keywords: Active matrix organic light emitting diodes; Adhesive joints; Adhesives; Conducting materials; Conductive adhesives; Finite element methods; Heating; Humidity; Independent component analysis; Mathematical models; Matrix materials; Moisture; Polymers; Shrinkage; Static electricity; Studies; Temperature dependence; Testing; Thermal cycling