Barrier height inhomogeneities induced anomaly in thermal sensitivity of Ni/4H-SiC Schottky diode temperature sensor
This paper presents the thermal sensitivity variation trend of Ni/4H-nSiC (0001) Schottky diode based temperature sensor, equipped with floating metal guard ring and oxide field plate as edge terminations in low current regime, i.e., ranging from 1 nA to 5 pA. Various measurements were carried out a...
Saved in:
Published in | Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Vol. 32; no. 4 |
---|---|
Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
01.07.2014
|
Online Access | Get full text |
ISSN | 2166-2746 1520-8567 2166-2754 |
DOI | 10.1116/1.4884756 |
Cover
Abstract | This paper presents the thermal sensitivity variation trend of Ni/4H-nSiC (0001) Schottky diode based temperature sensor, equipped with floating metal guard ring and oxide field plate as edge terminations in low current regime, i.e., ranging from 1 nA to 5 pA. Various measurements were carried out at temperatures ranging from 233 K to 473 K in steps of 20 K. An imperative outcome of the present study, which is in contrast with the theory, is that there exists an anomaly in the device thermal sensitivity behaviour after a range of current. The thermal sensitivity of the fabricated device, calculated from the slope of forward voltage versus temperature plot, was found to be varied from 3.11 mV/K at 1 nA to 3.32 mV/K at 5 pA with standard error of ±0.03 mV/K. A detailed analysis of I-V-T characteristics by taking into account all the possibilities for variation in the barrier height and the ideality factor with temperature emphasizes that there exist barrier height inhomogeneities at the metal–semiconductor interface in the fabricated device. These observations indicate that anomaly in the device thermal sensitivity was due to the barrier height inhomogeneities present in the device. |
---|---|
AbstractList | This paper presents the thermal sensitivity variation trend of Ni/4H-nSiC (0001) Schottky diode based temperature sensor, equipped with floating metal guard ring and oxide field plate as edge terminations in low current regime, i.e., ranging from 1 nA to 5 pA. Various measurements were carried out at temperatures ranging from 233 K to 473 K in steps of 20 K. An imperative outcome of the present study, which is in contrast with the theory, is that there exists an anomaly in the device thermal sensitivity behaviour after a range of current. The thermal sensitivity of the fabricated device, calculated from the slope of forward voltage versus temperature plot, was found to be varied from 3.11 mV/K at 1 nA to 3.32 mV/K at 5 pA with standard error of ±0.03 mV/K. A detailed analysis of I-V-T characteristics by taking into account all the possibilities for variation in the barrier height and the ideality factor with temperature emphasizes that there exist barrier height inhomogeneities at the metal–semiconductor interface in the fabricated device. These observations indicate that anomaly in the device thermal sensitivity was due to the barrier height inhomogeneities present in the device. |
Author | Maan, Anup Singh Akhtar, Jamil Kumar, Vibhor |
Author_xml | – sequence: 1 givenname: Vibhor surname: Kumar fullname: Kumar, Vibhor email: vibhorsoni123@gmail.com organization: Maharishi Dayanand University, Rohtak (Haryana), India 124001 and Central Electronics Engineering Research Institute (CSIR-CEERI), Pilani (Rajasthan) 333031, India – sequence: 2 givenname: Anup Singh surname: Maan fullname: Maan, Anup Singh organization: Maharishi Dayanand University, Rohtak (Haryana) 124001, India – sequence: 3 givenname: Jamil surname: Akhtar fullname: Akhtar, Jamil organization: Central Electronics Engineering Research Institute (CSIR-CEERI), Pilani (Rajasthan) 333031, India |
BookMark | eNp9kFFLwzAUhYNMcM49-A_yqtAtaZqkPupQJwx9mD6XNL1do2szkmzQf290E0HU-3Lvge8cLucUDTrbAULnlEwopWJKJ1meZ5KLIzSkPCVJzoUcoGFKhUhSmYkTNPb-lcQROSeMDFG4Uc4ZcLgBs2oCNl1jW7uCDkww4KOuthoqrDrbqnUfNQ4NuHhjD52P0M6EHtsaP5ppNk-WZoaXurEhvPW4MrYCHKDdgFNh6-DTY90ZOq7V2sP4sEfo5e72eTZPFk_3D7PrRaKZ4CFJSyZJxcsqZ_FhqEvQlGUsUwQkz6UmgpJcpTUFxrSUEaal1FcgCEkzxhUboYt9rnbWewd1sXGmVa4vKCk-GitocWgsstMfrDZBBWO74JRZ_-q43Dv8F_lv_J_wzrpvsNhUNXsH_NWMMA |
CODEN | JVTBD9 |
CitedBy_id | crossref_primary_10_1016_j_mssp_2015_04_031 crossref_primary_10_1016_j_matpr_2021_02_226 crossref_primary_10_1080_02286203_2021_1983074 crossref_primary_10_3390_cryst12020245 crossref_primary_10_3390_s19102384 crossref_primary_10_3390_s21248358 crossref_primary_10_3390_ma14030683 crossref_primary_10_3390_cryst12050582 crossref_primary_10_1109_JSEN_2021_3133895 crossref_primary_10_3390_mi14081621 crossref_primary_10_1109_JESTPE_2019_2942714 crossref_primary_10_1116_6_0002411 crossref_primary_10_1016_j_vacuum_2020_109395 crossref_primary_10_1109_JSEN_2019_2939045 crossref_primary_10_1116_6_0003463 crossref_primary_10_1016_j_vacuum_2020_109590 crossref_primary_10_1016_j_proeng_2016_11_262 crossref_primary_10_1088_1674_1056_28_2_027303 crossref_primary_10_1166_sam_2021_3989 crossref_primary_10_1002_pssa_201532454 crossref_primary_10_1016_j_sna_2017_11_026 crossref_primary_10_3390_ma13020445 crossref_primary_10_3390_ma17153665 crossref_primary_10_1109_JSEN_2018_2883544 crossref_primary_10_1116_6_0002976 crossref_primary_10_3390_electronics12112501 crossref_primary_10_1002_pssa_201700555 crossref_primary_10_1063_1_4923468 crossref_primary_10_1116_1_4929890 crossref_primary_10_3390_s21030942 crossref_primary_10_1016_j_matpr_2022_10_076 crossref_primary_10_1016_j_matpr_2022_10_077 crossref_primary_10_3390_mi16010055 crossref_primary_10_1007_s00339_024_08076_4 crossref_primary_10_1007_s13204_021_01921_5 crossref_primary_10_1063_1_4999296 crossref_primary_10_1116_6_0002030 crossref_primary_10_1116_6_0004273 crossref_primary_10_3390_electronics11060880 crossref_primary_10_1109_TIA_2021_3087667 crossref_primary_10_3390_en15051667 crossref_primary_10_1016_j_mssp_2020_105108 crossref_primary_10_1016_j_spmi_2016_10_034 crossref_primary_10_1007_s11664_021_09254_3 crossref_primary_10_7567_JJAP_55_124101 crossref_primary_10_1007_s13204_020_01608_3 crossref_primary_10_1088_1361_6463_ace373 |
Cites_doi | 10.1063/1.2769284 10.1007/s11664-000-0081-9 10.1016/j.sse.2008.05.013 10.1109/JPROC.2002.1021571 10.1063/1.1573750 10.1109/IEDM.1990.237044 10.1088/0268-1242/12/7/023 10.1007/s100510050634 10.1109/SMICND.2009.5336658 10.1016/S0168-9002(01)00601-5 10.3390/s130201884 10.1007/s00339-008-4411-8 10.1109/TSM.2012.2214245 10.1016/0921-5107(95)01276-1 10.1109/SMICND.2010.5650596 10.1103/PhysRevB.42.5249 10.1016/j.mee.2008.10.015 10.1063/1.3600229 10.1002/pssa.200460475 10.1016/j.microrel.2011.07.094 10.1088/0022-3727/43/22/223001 10.1088/0022-3735/7/9/011 10.1016/j.microrel.2004.01.017 10.1016/j.mee.2010.12.070 10.1063/1.3147903 10.1103/PhysRev.105.1721 10.1116/1.589442 10.1063/1.353249 10.1109/55.192814 10.1016/j.physb.2011.05.001 10.1063/1.2141719 10.1016/j.apsusc.2004.12.020 10.1116/1.590839 10.1063/1.1147565 10.1103/PhysRevB.64.075310 10.1016/0038-1101(86)90145-0 |
ContentType | Journal Article |
Copyright | American Vacuum Society |
Copyright_xml | – notice: American Vacuum Society |
DBID | AAYXX CITATION |
DOI | 10.1116/1.4884756 |
DatabaseName | CrossRef |
DatabaseTitle | CrossRef |
DatabaseTitleList | CrossRef |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering Physics |
EISSN | 1520-8567 2166-2754 |
ExternalDocumentID | 10_1116_1_4884756 |
GroupedDBID | .DC 29L 5-Q 5GY AAAAW AAEUA ABFTF ABJNI ACBRY ADLOM AENEX AGTJO AI. ALMA_UNASSIGNED_HOLDINGS ARCSS BAUXJ H~9 M43 M71 M73 RAW RIP RNS ROL RQS VAS VH1 WH7 XFK AAGWI AAPUP AAYIH AAYXX ABJGX ABNAN ACGFS ADMLS AFHCQ AGKCL AGVCI CITATION EBS EJD |
ID | FETCH-LOGICAL-c365t-2b370d5bd83006efbec13434a0e7587c06108a2f1e33c773701b7c9e6002435a3 |
ISSN | 2166-2746 |
IngestDate | Tue Jul 01 02:43:39 EDT 2025 Thu Apr 24 22:58:40 EDT 2025 Fri Jun 21 00:16:46 EDT 2024 Sun Jul 14 10:05:11 EDT 2019 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 4 |
Language | English |
License | 2166-2746/2014/32(4)/041203/8/$30.00 |
LinkModel | OpenURL |
MergedId | FETCHMERGED-LOGICAL-c365t-2b370d5bd83006efbec13434a0e7587c06108a2f1e33c773701b7c9e6002435a3 |
PageCount | 8 |
ParticipantIDs | scitation_primary_10_1116_1_4884756 crossref_primary_10_1116_1_4884756 crossref_citationtrail_10_1116_1_4884756 |
ProviderPackageCode | CITATION AAYXX |
PublicationCentury | 2000 |
PublicationDate | 2014-07-01 |
PublicationDateYYYYMMDD | 2014-07-01 |
PublicationDate_xml | – month: 07 year: 2014 text: 2014-07-01 day: 01 |
PublicationDecade | 2010 |
PublicationTitle | Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures |
PublicationYear | 2014 |
References | Griffiths, Stow, Syms (c8) 1974; 7 Draghici, Badila, Brezeanu, Rusu, Craciunoiu, Enache (c10) 2010; 2 Saadaoui, Salem, Gassoumi, Maaref, Gaquiere (c28) 2011; 110 Schmitsdorf, Monch (c38) 1999; 7 Im, Ding, Pelz (c31) 2001; 64 Monch (c35) 1999; 17 Wittmer (c42) 1990; 42 Duman, Dogan, Gurbulak, Turut (c25) 2008; 91 Tumakha, Ewing, Porter, Wahab, Ma, Sudharshan, Brillson (c39) 2005; 87 Boussouar, Ouennoughi, Rouag, Sellai, Weiss, Ryssel (c26) 2011; 88 Ito, Taguchi, Soga, Mitsuhashi, Shinohara, Ogashiwa, Nishimori, Akiyama (c15) 2012; 52 Choyke, Patrick (c30) 1957; 105 Josan, Boianceanu1, Brezeanu, Obreja, Avram, Puscasu, Ioncea (c19) 2009; 2 Iwami (c3) 2001; 466 Davis, Palmour, Edmond (c2); 1990 Toumi, Hamida, Boussouar, Sellai, Ouennoughi, Ryssel (c27) 2009; 86 Schmitsdorf, Kampen, Monch (c36) 1997; 15 Sozza, Dua, Kerlain, Brylinski, Zanoni (c16) 2004; 44 Karoui, Gharbi, Alzaied, Fathallah, Tresso, Scaltrito, Ferrero (c23) 2008; 52 Neudeck, Okojie, Chen (c6) 2002; 90 Werner, Guttler (c29) 1993; 73 Vanalmey, Meirhaeghey, Cardony, Daelez (c34) 1997; 12 Roccaforte, Via, Raineri, Pierobon, Zanoni (c37) 2003; 93 Skromme, Luckowski, Moore, Bhatnagar, Weitze, Gehoski, Ganser (c40) 2000; 29 Hassan, Bergman (c24) 2009; 105 Perez, Mestres, Montserrat, Tournier, Godignon (c33) 2005; 202 Bhatnagar, McLarty, Baliga (c5) 1992; 13 Porter, Davis (c4) 1995; 34 Aydogan, Saglam, Turut (c32) 2005; 250 Bose, Ota (c12) 1996; 67 Gupta, Pradhan, Shekhar, Akhtar (c14) 2012; 25 Yang (c7) 2013; 13 Song, Meirhaeghe, Laflere, Cardon (c41) 1986; 29 Roccaforte, Giannazzo, Raineri (c22) 2010; 43 Gupta, Azam (c17) 2011; 406 Aydın, Yıldırım, Turut (c21) 2007; 102 (2023070921262520100_c2); 1990 (2023070921262520100_c25) 2008; 91 (2023070921262520100_c31) 2001; 64 (2023070921262520100_c9) 2010 (2023070921262520100_c32) 2005; 250 (2023070921262520100_c41) 1986; 29 (2023070921262520100_c16) 2004; 44 (2023070921262520100_c6) 2002; 90 (2023070921262520100_c19) 2009; 2 (2023070921262520100_c21) 2007; 102 (2023070921262520100_c15) 2012; 52 (2023070921262520100_c7) 2013; 13 (2023070921262520100_c26) 2011; 88 (2023070921262520100_c1) 2005 (2023070921262520100_c23) 2008; 52 (2023070921262520100_c10) 2010; 2 (2023070921262520100_c34) 1997; 12 (2023070921262520100_c3) 2001; 466 (2023070921262520100_c28) 2011; 110 (2023070921262520100_c42) 1990; 42 (2023070921262520100_c33) 2005; 202 (2023070921262520100_c13) 1998 (2023070921262520100_c38) 1999; 7 (2023070921262520100_c14) 2012; 25 (2023070921262520100_c8) 1974; 7 (2023070921262520100_c30) 1957; 105 (2023070921262520100_c40) 2000; 29 (2023070921262520100_c27) 2009; 86 (2023070921262520100_c35) 1999; 17 (2023070921262520100_c4) 1995; 34 (2023070921262520100_c29) 1993; 73 (2023070921262520100_c24) 2009; 105 (2023070921262520100_c12) 1996; 67 (2023070921262520100_c39) 2005; 87 (2023070921262520100_c36) 1997; 15 (2023070921262520100_c5) 1992; 13 (2023070921262520100_c11) 2008 (2023070921262520100_c17) 2011; 406 (2023070921262520100_c22) 2010; 43 (2023070921262520100_c18) 1988 2023070921262520100_c20 (2023070921262520100_c37) 2003; 93 |
References_xml | – volume: 110 start-page: 013701 year: 2011 ident: c28 publication-title: J. Appl. Phys. – volume: 15 start-page: 1221 year: 1997 ident: c36 publication-title: J. Vac. Sci. Technol. B – volume: 202 start-page: 692 year: 2005 ident: c33 publication-title: Phys. Status Solidi A – volume: 12 start-page: 907 year: 1997 ident: c34 publication-title: Semicond. Sci. Technol. – volume: 93 start-page: 9137 year: 2003 ident: c37 publication-title: J. Appl. Phys. – volume: 406 start-page: 3030 year: 2011 ident: c17 publication-title: J. Akhtar Physica B – volume: 13 start-page: 1884 year: 2013 ident: c7 publication-title: Sensors – volume: 102 start-page: 043701 year: 2007 ident: c21 publication-title: J. Appl. Phys. – volume: 91 start-page: 337 year: 2008 ident: c25 publication-title: Appl. Phys. A – volume: 88 start-page: 969 year: 2011 ident: c26 publication-title: Microelectron. Eng. – volume: 73 start-page: 1315 year: 1993 ident: c29 publication-title: J. Appl. Phys. – volume: 29 start-page: 376 year: 2000 ident: c40 publication-title: J. Electron. Mater. – volume: 34 start-page: 83 year: 1995 ident: c4 publication-title: Mater. Sci. Eng. B – volume: 67 start-page: 4176 year: 1996 ident: c12 publication-title: Rev. Sci. Instrum. – volume: 2 start-page: 409 year: 2010 ident: c10 publication-title: Int. Semicond. Conf. – volume: 13 start-page: 501 year: 1992 ident: c5 publication-title: IEEE Electron Device Lett. – volume: 42 start-page: 5249 year: 1990 ident: c42 publication-title: Phys. Rev. B – volume: 44 start-page: 1109 year: 2004 ident: c16 publication-title: Microelectron. Reliab. – volume: 1990 start-page: 785 ident: c2 publication-title: IEDM Electron Devices Meet. – volume: 86 start-page: 303 year: 2009 ident: c27 publication-title: Microelectron. Eng. – volume: 105 start-page: 123518 year: 2009 ident: c24 publication-title: J. Appl. Phys. – volume: 64 start-page: 075310 year: 2001 ident: c31 publication-title: Phys. Rev. B – volume: 52 start-page: 199 year: 2012 ident: c15 publication-title: Microelectron. Reliab. – volume: 52 start-page: 1232 year: 2008 ident: c23 publication-title: Solid State Electron. – volume: 17 start-page: 1867 year: 1999 ident: c35 publication-title: J. Vac. Sci. Technol. B – volume: 7 start-page: 710 year: 1974 ident: c8 publication-title: J. Phys. E: Sci. Instrum. – volume: 87 start-page: 242106 year: 2005 ident: c39 publication-title: Appl. Phys. Lett. – volume: 2 start-page: 525 year: 2009 ident: c19 publication-title: Int. Semicond. Conf. – volume: 43 start-page: 223001 year: 2010 ident: c22 publication-title: J. Phys. D: Appl. Phys. – volume: 7 start-page: 457 year: 1999 ident: c38 publication-title: Eur. Phys. J. B – volume: 29 start-page: 633 year: 1986 ident: c41 publication-title: Solid State Electron. – volume: 466 start-page: 406 year: 2001 ident: c3 publication-title: Nucl. Instrum. Methods Phys. Res. A – volume: 250 start-page: 43 year: 2005 ident: c32 publication-title: Appl. Surf. Sci. – volume: 105 start-page: 1721 year: 1957 ident: c30 publication-title: Phys. Rev. – volume: 90 start-page: 1065 year: 2002 ident: c6 publication-title: Proc. IEEE – volume: 25 start-page: 664 year: 2012 ident: c14 publication-title: IEEE Trans. Semicond. Manufac. – volume: 102 start-page: 043701 year: 2007 ident: 2023070921262520100_c21 publication-title: J. Appl. Phys. doi: 10.1063/1.2769284 – volume: 29 start-page: 376 year: 2000 ident: 2023070921262520100_c40 publication-title: J. Electron. Mater. doi: 10.1007/s11664-000-0081-9 – volume: 52 start-page: 1232 year: 2008 ident: 2023070921262520100_c23 publication-title: Solid State Electron. doi: 10.1016/j.sse.2008.05.013 – volume-title: Metal-Semiconductor Contacts year: 1988 ident: 2023070921262520100_c18 – volume: 90 start-page: 1065 year: 2002 ident: 2023070921262520100_c6 publication-title: Proc. IEEE doi: 10.1109/JPROC.2002.1021571 – volume: 93 start-page: 9137 year: 2003 ident: 2023070921262520100_c37 publication-title: J. Appl. Phys. doi: 10.1063/1.1573750 – volume: 1990 start-page: 785 ident: 2023070921262520100_c2 publication-title: IEDM Electron Devices Meet. doi: 10.1109/IEDM.1990.237044 – volume: 12 start-page: 907 year: 1997 ident: 2023070921262520100_c34 publication-title: Semicond. Sci. Technol. doi: 10.1088/0268-1242/12/7/023 – volume: 7 start-page: 457 year: 1999 ident: 2023070921262520100_c38 publication-title: Eur. Phys. J. B doi: 10.1007/s100510050634 – volume: 2 start-page: 525 year: 2009 ident: 2023070921262520100_c19 publication-title: Int. Semicond. Conf. doi: 10.1109/SMICND.2009.5336658 – start-page: 575 volume-title: European Conference on Silicon Carbide and Related Materials year: 2010 ident: 2023070921262520100_c9 – volume: 466 start-page: 406 year: 2001 ident: 2023070921262520100_c3 publication-title: Nucl. Instrum. Methods Phys. Res. A doi: 10.1016/S0168-9002(01)00601-5 – volume: 13 start-page: 1884 year: 2013 ident: 2023070921262520100_c7 publication-title: Sensors doi: 10.3390/s130201884 – volume: 91 start-page: 337 year: 2008 ident: 2023070921262520100_c25 publication-title: Appl. Phys. A doi: 10.1007/s00339-008-4411-8 – volume: 25 start-page: 664 year: 2012 ident: 2023070921262520100_c14 publication-title: IEEE Trans. Semicond. Manufac. doi: 10.1109/TSM.2012.2214245 – volume: 34 start-page: 83 year: 1995 ident: 2023070921262520100_c4 publication-title: Mater. Sci. Eng. B doi: 10.1016/0921-5107(95)01276-1 – volume: 2 start-page: 409 year: 2010 ident: 2023070921262520100_c10 publication-title: Int. Semicond. Conf. doi: 10.1109/SMICND.2010.5650596 – volume: 42 start-page: 5249 year: 1990 ident: 2023070921262520100_c42 publication-title: Phys. Rev. B doi: 10.1103/PhysRevB.42.5249 – volume-title: SiC Power Devices year: 2005 ident: 2023070921262520100_c1 – volume: 86 start-page: 303 year: 2009 ident: 2023070921262520100_c27 publication-title: Microelectron. Eng. doi: 10.1016/j.mee.2008.10.015 – volume: 110 start-page: 013701 year: 2011 ident: 2023070921262520100_c28 publication-title: J. Appl. Phys. doi: 10.1063/1.3600229 – volume: 202 start-page: 692 year: 2005 ident: 2023070921262520100_c33 publication-title: Phys. Status Solidi A doi: 10.1002/pssa.200460475 – volume: 52 start-page: 199 year: 2012 ident: 2023070921262520100_c15 publication-title: Microelectron. Reliab. doi: 10.1016/j.microrel.2011.07.094 – volume: 43 start-page: 223001 year: 2010 ident: 2023070921262520100_c22 publication-title: J. Phys. D: Appl. Phys. doi: 10.1088/0022-3727/43/22/223001 – volume: 7 start-page: 710 year: 1974 ident: 2023070921262520100_c8 publication-title: J. Phys. E: Sci. Instrum. doi: 10.1088/0022-3735/7/9/011 – volume: 44 start-page: 1109 year: 2004 ident: 2023070921262520100_c16 publication-title: Microelectron. Reliab. doi: 10.1016/j.microrel.2004.01.017 – volume: 88 start-page: 969 year: 2011 ident: 2023070921262520100_c26 publication-title: Microelectron. Eng. doi: 10.1016/j.mee.2010.12.070 – start-page: 16 volume-title: Proceedings of the Workshop on Microelectronics and Electron Devices (WMED) year: 2008 ident: 2023070921262520100_c11 – volume: 105 start-page: 123518 year: 2009 ident: 2023070921262520100_c24 publication-title: J. Appl. Phys. doi: 10.1063/1.3147903 – volume: 105 start-page: 1721 year: 1957 ident: 2023070921262520100_c30 publication-title: Phys. Rev. doi: 10.1103/PhysRev.105.1721 – volume: 15 start-page: 1221 year: 1997 ident: 2023070921262520100_c36 publication-title: J. Vac. Sci. Technol. B doi: 10.1116/1.589442 – volume: 73 start-page: 1315 year: 1993 ident: 2023070921262520100_c29 publication-title: J. Appl. Phys. doi: 10.1063/1.353249 – volume: 13 start-page: 501 year: 1992 ident: 2023070921262520100_c5 publication-title: IEEE Electron Device Lett. doi: 10.1109/55.192814 – volume: 406 start-page: 3030 year: 2011 ident: 2023070921262520100_c17 publication-title: J. Akhtar Physica B doi: 10.1016/j.physb.2011.05.001 – volume: 87 start-page: 242106 year: 2005 ident: 2023070921262520100_c39 publication-title: Appl. Phys. Lett. doi: 10.1063/1.2141719 – start-page: 88 volume-title: Proceedings of International Caracas Conference on Devices, Circuits and Systems year: 1998 ident: 2023070921262520100_c13 – volume: 250 start-page: 43 year: 2005 ident: 2023070921262520100_c32 publication-title: Appl. Surf. Sci. doi: 10.1016/j.apsusc.2004.12.020 – volume: 17 start-page: 1867 year: 1999 ident: 2023070921262520100_c35 publication-title: J. Vac. Sci. Technol. B doi: 10.1116/1.590839 – volume: 67 start-page: 4176 year: 1996 ident: 2023070921262520100_c12 publication-title: Rev. Sci. Instrum. doi: 10.1063/1.1147565 – volume: 64 start-page: 075310 year: 2001 ident: 2023070921262520100_c31 publication-title: Phys. Rev. B doi: 10.1103/PhysRevB.64.075310 – volume-title: Physics of Semiconductor Devices ident: 2023070921262520100_c20 – volume: 29 start-page: 633 year: 1986 ident: 2023070921262520100_c41 publication-title: Solid State Electron. doi: 10.1016/0038-1101(86)90145-0 |
SSID | ssj0000685030 ssj0006533 |
Score | 2.3518622 |
Snippet | This paper presents the thermal sensitivity variation trend of Ni/4H-nSiC (0001) Schottky diode based temperature sensor, equipped with floating metal guard... |
SourceID | crossref scitation |
SourceType | Enrichment Source Index Database Publisher |
Title | Barrier height inhomogeneities induced anomaly in thermal sensitivity of Ni/4H-SiC Schottky diode temperature sensor |
URI | http://dx.doi.org/10.1116/1.4884756 |
Volume | 32 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3db9MwELdK9wA8ID7FGCALeECK0iVxPh-7AaomupduaG-RYztqtDapSjJp-2f4Vzk7jhNGkTZeosa6ayLfT-fz5fw7hD5xTtyQyZon4nHb55Tb4PMiG4JRFojEE4mQZ4fnp-Hs3D-5CC5Go1-DqqWmzibsZue5kv-xKoyBXeUp2XtY1vwpDMBvsC9cwcJwvZONj-hWNZxbqvymVZTLal2BtFA0qXDPG_l5n5bVmq6udUkjeOKV9VPWrevGETJnIF_Cn9mL4ljxctb15bXFi4oLS3JXaeJlpVVt_xHPXlHWNGurOyekKjNN3n5iHWlfXvWDCnZrWRHYN-MZfFvStd8_imxZmRLiOaWa9KDZWAtYd006e3q5rFuNE5m0GaYzXN-Uvmqv57lhaMNWWfNjD8datunObfdp0S4nsWM1UImJCTgpPwp2MG7fWglNfWK7MwpTN9WqD9CeF0FwNkZ70y_z7wuTxnPCOHBURxvz4pq_CvQPzaP_iHoegiXaOotBKHP2FD3RNsPTFlDP0EiUz9HjATPlC1RraOEWWvgWtLCGFtbQgnusoYUH0MJVjk-LwxZYuAMWVsDCA2DhFlgv0fm3r2fHM1s36LAZCYPa9jISOTzIeExgIkQO_sAlPvGpI2AbGjGIFZ2YerkrCGFRBMJuFrFEhIoHM6DkFRqXVSleI8zzhJAkhgXHY74raBZkjg8BHKjwmLnBPvrcTWDazZ5sorJK_7LVPvpgRDctZcsuoY_GCveUuqq2vUS64fmbuzzwAD3q4f4WjettI95BPFtn7zWmfgOoAqPL |
linkProvider | EBSCOhost |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Barrier+height+inhomogeneities+induced+anomaly+in+thermal+sensitivity+of+Ni%2F4H-SiC+Schottky+diode+temperature+sensor&rft.jtitle=Journal+of+vacuum+science+and+technology.+B%2C+Nanotechnology+%26+microelectronics&rft.au=Kumar%2C+Vibhor&rft.au=Maan%2C+Anup+Singh&rft.au=Akhtar%2C+Jamil&rft.date=2014-07-01&rft.issn=2166-2746&rft.eissn=2166-2754&rft.volume=32&rft.issue=4&rft_id=info:doi/10.1116%2F1.4884756&rft.externalDBID=n%2Fa&rft.externalDocID=10_1116_1_4884756 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2166-2746&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2166-2746&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2166-2746&client=summon |