3D CT Slice Image-Based Algorithm for Non-Wet Defect Inspection in Solder Joints - Lee, Sung Ju; Lee, Sang Hwa; Cho, Nam Ik (IEEE access, 2025)
Keywords: 3D CT slice image; Computed tomography; Defects; Feature extraction; Inspection; Machine learning; non-wet defect inspection; Pipelines; semiconductor chip; Semiconductors; Sensitivity; solder joint; Soldered joints; Soldering; Solders; Solid modeling; Supervised learning; Three-dimensional displays; Training; X-ray imaging