Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

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Bibliographic Details
Published inAdvanced Design and Manufacture III p. 1
Main Authors Zhang Qingbin, Su Daizhong, Zhu Shifan
Format Book Chapter
LanguageEnglish
Published Trans Tech Publications 01.01.2011
Subjects
Manufacturing Engineering
Materials & Manufacturing Processes
Online AccessGet full text
ISBN087849250X
9780878492503
DOI10.4028/www.scientific.net/KEM.450.296

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Table of Contents:
  • 73.1 Introduction 73.2 Experiments 73.3 Results and Analysis 73.4 Conclusions Acknowledgement References