Precise identification of <1 0 0> directions on Si{0 0 1} wafer using a novel self-aligning pre-etched technique

Micromirrors with a tilt angle of 45° are widely used in optical switching and interconnect applications which require 90° out of plane reflection. Silicon wet bulk micromachining based on surfactant added TMAH is usually employed to fabricate 45° slanted walls at the direction on Si wafers. These s...

Full description

Saved in:
Bibliographic Details
Published inJournal of micromechanics and microengineering Vol. 26; no. 2; pp. 25012 - 25016
Main Authors Singh, S S, Veerla, S, Sharma, V, Pandey, A K, Pal, P
Format Journal Article
LanguageEnglish
Published IOP Publishing 01.02.2016
Subjects
Online AccessGet full text
ISSN0960-1317
1361-6439
DOI10.1088/0960-1317/26/2/025012

Cover

Abstract Micromirrors with a tilt angle of 45° are widely used in optical switching and interconnect applications which require 90° out of plane reflection. Silicon wet bulk micromachining based on surfactant added TMAH is usually employed to fabricate 45° slanted walls at the direction on Si wafers. These slanted walls are used as 45° micromirrors. However, the appearance of a precise 45° wall is subject to the accurate identification of the direction. In this paper, we present a simple technique based on pre-etched patterns for the identification of directions on the Si surface. The proposed pre-etched pattern self-aligns itself at the direction while becoming misaligned at other directions. The direction is determined by a simple visual inspection of pre-etched patterns and does not need any kind of measurement. To test the accuracy of the proposed method, we fabricated a 32 mm long rectangular opening with its sides aligned along the direction, which is determined using the proposed technique. Due to the finite etch rate of the plane, undercutting occurred, which was measured at 12 different locations along the longer edge of the rectangular strip. The mean of these undercutting lengths, measured perpendicular to the mask edge, is found to be 13.41 μm with a sub-micron standard deviation of 0.38 μm. This level of uniform undercutting indicates that our method of identifying the direction is precise and accurate. The developed method will be extremely useful in fabricating arrays of 45° micromirrors.
AbstractList Micromirrors with a tilt angle of 45° are widely used in optical switching and interconnect applications which require 90° out of plane reflection. Silicon wet bulk micromachining based on surfactant added TMAH is usually employed to fabricate 45° slanted walls at the direction on Si wafers. These slanted walls are used as 45° micromirrors. However, the appearance of a precise 45° wall is subject to the accurate identification of the direction. In this paper, we present a simple technique based on pre-etched patterns for the identification of directions on the Si surface. The proposed pre-etched pattern self-aligns itself at the direction while becoming misaligned at other directions. The direction is determined by a simple visual inspection of pre-etched patterns and does not need any kind of measurement. To test the accuracy of the proposed method, we fabricated a 32 mm long rectangular opening with its sides aligned along the direction, which is determined using the proposed technique. Due to the finite etch rate of the plane, undercutting occurred, which was measured at 12 different locations along the longer edge of the rectangular strip. The mean of these undercutting lengths, measured perpendicular to the mask edge, is found to be 13.41 μm with a sub-micron standard deviation of 0.38 μm. This level of uniform undercutting indicates that our method of identifying the direction is precise and accurate. The developed method will be extremely useful in fabricating arrays of 45° micromirrors.
Micromirrors with a tilt angle of 45 degree are widely used in optical switching and interconnect applications which require 90 degree out of plane reflection. Silicon wet bulk micromachining based on surfactant added TMAH is usually employed to fabricate 45 degree slanted walls at the &$\langle 1\,0\,0\rangle $ ; direction on Si&$\left\{0\,0\,1\right\}$ ; wafers. These slanted walls are used as 45 degree micromirrors. However, the appearance of a precise 45 degree &$\left\{0\,1\,1\right\}$ ; wall is subject to the accurate identification of the &$\langle 1\,0\,0\rangle $ ; direction. In this paper, we present a simple technique based on pre-etched patterns for the identification of &$\langle 1\,0\,0\rangle $ ; directions on the Si&$\left\{0\,0\,1\right\}$ ; surface. The proposed pre-etched pattern self-aligns itself at the &$\langle 1\,0\,0\rangle $ ; direction while becoming misaligned at other directions. The &$\langle 1\,0\,0\rangle $ ; direction is determined by a simple visual inspection of pre-etched patterns and does not need any kind of measurement. To test the accuracy of the proposed method, we fabricated a 32 mm long rectangular opening with its sides aligned along the &$\langle 1\,0\,0\rangle $ ; direction, which is determined using the proposed technique. Due to the finite etch rate of the &$\left\{1\,1\,0\right\}$ ; plane, undercutting occurred, which was measured at 12 different locations along the longer edge of the rectangular strip. The mean of these undercutting lengths, measured perpendicular to the mask edge, is found to be 13.41 mu m with a sub-micron standard deviation of 0.38 mu m. This level of uniform undercutting indicates that our method of identifying the &$\langle 1\,0\,0\rangle $ ; direction is precise and accurate. The developed method will be extremely useful in fabricating arrays of 45 degree micromirrors.
Author Singh, S S
Pandey, A K
Sharma, V
Pal, P
Veerla, S
Author_xml – sequence: 1
  givenname: S S
  surname: Singh
  fullname: Singh, S S
  email: me11b028@iith.ac.in
  organization: Indian Institute of Technology Hyderabad Department of Mechanical and Aerospace Engineering, Telangana 502285, India
– sequence: 2
  givenname: S
  surname: Veerla
  fullname: Veerla, S
  organization: Indian Institute of Technology Hyderabad Department of Physics, Telangana 502285, India
– sequence: 3
  givenname: V
  surname: Sharma
  fullname: Sharma, V
  organization: Indian Institute of Technology Hyderabad Department of Mechanical and Aerospace Engineering, Telangana 502285, India
– sequence: 4
  givenname: A K
  surname: Pandey
  fullname: Pandey, A K
  organization: Indian Institute of Technology Hyderabad Department of Mechanical and Aerospace Engineering, Telangana 502285, India
– sequence: 5
  givenname: P
  surname: Pal
  fullname: Pal, P
  email: prem@iith.ac.in
  organization: Indian Institute of Technology Hyderabad Department of Physics, Telangana 502285, India
BookMark eNqFkNFKHDEUhoMouGofoZC7ejNuzswkk0ERRKwtCArV65DNnOxmmU3GZNZWpOBtX7NP0pmuFJGCF4fA-f_vBL49su2DR0I-AjsCJuWU1YJlUEA1zcU0n7KcM8i3yAQKAZkoi3qbTP51dsleSkvGACTICflxE9G4hNQ16HtnndG9C54GS0_g9_MvNs4pbdxQG4NEh_Cbe2IvGfyk37XFSNfJ-TnV1IcHbGnC1ma6dXM_bruIGfZmgQ3t0Sy8u1_jAdmxuk344eXdJ3efL27Pv2RX15dfz8-uMlMI1md1KcQwZVlXtuFCgCyFzauiNnImZnrGdSN1KQxv0IDUWEluKimKCoADt6bYJ4ebu10Mw7epVyuXDLat9hjWSYHMeVkKVtdD9XhTNTGkFNEq4_q_OvqoXauAqdG3Gl2q0aXKhcrVxvdA8zd0F91Kx8d3OdhwLnRqGdbRDzreZT79h1muVq9bqmts8QfWrqPZ
CODEN JMMIEZ
CitedBy_id crossref_primary_10_1088_1742_6596_757_1_012018
crossref_primary_10_1186_s40486_016_0027_5
crossref_primary_10_1186_s40486_018_0066_1
crossref_primary_10_1007_s00542_016_2984_2
crossref_primary_10_1088_1361_6439_aad507
Cites_doi 10.1109/T-ED.1978.19250
10.1007/s00542-004-0456-6
10.1088/0960-1317/17/11/017
10.1186/s40486-015-0009-z
10.1049/mnl.2014.0214
10.1016/j.sna.2014.05.011
10.1088/0960-1317/8/4/011
10.1143/JJAP.49.096503
10.1016/j.sna.2009.10.023
10.1016/S0924-4247(00)00317-4
10.1109/JMEMS.2009.2031688
10.1109/Transducers.2013.6627183
10.1088/0960-1317/15/6/007
10.1088/0960-1317/2/1/003
10.1016/0924-4247(92)80139-T
10.1088/0960-1317/15/11/006
10.1007/s00542-013-1859-z
10.1088/0960-1317/16/10/034
10.1016/j.sna.2008.09.002
10.1149/1.2086277
10.1088/0960-1317/13/1/307
10.1109/MEMSYS.1999.746904
10.1063/1.1657233
10.1016/S0924-4247(01)00648-3
10.1016/0924-4247(96)80158-0
10.1186/2213-9621-1-1
10.1016/j.sna.2010.12.018
10.1007/s00542-009-0956-5
10.1088/0960-1317/6/2/011
ContentType Journal Article
Copyright 2016 IOP Publishing Ltd
Copyright_xml – notice: 2016 IOP Publishing Ltd
DBID AAYXX
CITATION
7TB
8FD
FR3
DOI 10.1088/0960-1317/26/2/025012
DatabaseName CrossRef
Mechanical & Transportation Engineering Abstracts
Technology Research Database
Engineering Research Database
DatabaseTitle CrossRef
Technology Research Database
Mechanical & Transportation Engineering Abstracts
Engineering Research Database
DatabaseTitleList
Technology Research Database
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
Physics
DocumentTitleAlternate Precise identification of <1 0 0> directions on Si{0 0 1} wafer using a novel self-aligning pre-etched technique
EISSN 1361-6439
EndPage 25016
ExternalDocumentID 10_1088_0960_1317_26_2_025012
jmmaa0d8d
GrantInformation_xml – fundername: Council for Scientific and Industrial Research
  grantid: CSIR; Ref: 03(1320)/14/EMR-II
  funderid: http://dx.doi.org/10.13039/501100001332
GroupedDBID -~X
1JI
4.4
5B3
5GY
5PX
5VS
5ZH
7.M
7.Q
AAGCD
AAHTB
AAJIO
AAJKP
AALHV
AATNI
ABHWH
ABJNI
ABPEJ
ABQJV
ABVAM
ACAFW
ACBEA
ACGFO
ACGFS
ACHIP
AEFHF
AENEX
AFYNE
AKPSB
ALMA_UNASSIGNED_HOLDINGS
AOAED
ASPBG
ATQHT
AVWKF
AZFZN
CBCFC
CEBXE
CJUJL
CRLBU
CS3
DU5
EBS
EDWGO
EJD
EMSAF
EPQRW
EQZZN
F5P
HAK
IHE
IJHAN
IOP
IZVLO
KOT
LAP
M45
N5L
N9A
NT-
NT.
P2P
PJBAE
R4D
RIN
RNS
RO9
ROL
RPA
SY9
TN5
UCJ
W28
XPP
ZMT
AAYXX
ADEQX
CITATION
7TB
8FD
AEINN
FR3
ID FETCH-LOGICAL-c360t-94669464497fd5661846f2739c8b6bab5ad8a46c5dec18ae785c7863711515fc3
IEDL.DBID IOP
ISSN 0960-1317
IngestDate Tue Aug 05 11:23:24 EDT 2025
Thu Apr 24 23:12:17 EDT 2025
Tue Jul 01 02:48:13 EDT 2025
Wed Aug 21 03:33:25 EDT 2024
Thu Jan 07 13:53:45 EST 2021
IsPeerReviewed true
IsScholarly true
Issue 2
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c360t-94669464497fd5661846f2739c8b6bab5ad8a46c5dec18ae785c7863711515fc3
Notes JMM-101833.R1
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
PQID 1825446099
PQPubID 23500
PageCount 5
ParticipantIDs iop_journals_10_1088_0960_1317_26_2_025012
crossref_citationtrail_10_1088_0960_1317_26_2_025012
crossref_primary_10_1088_0960_1317_26_2_025012
proquest_miscellaneous_1825446099
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2016-02-01
PublicationDateYYYYMMDD 2016-02-01
PublicationDate_xml – month: 02
  year: 2016
  text: 2016-02-01
  day: 01
PublicationDecade 2010
PublicationTitle Journal of micromechanics and microengineering
PublicationTitleAbbrev JMM
PublicationTitleAlternate J. Micromech. Microeng
PublicationYear 2016
Publisher IOP Publishing
Publisher_xml – name: IOP Publishing
References 22
23
24
Vangbo M (27) 1996; 6
28
Sekimura M (10) 1999
Lai J M (31) 1998; 8
Tseng F G (26) 2003; 13
Pal P (8) 2010; 49
Resnik D (12) 2005; 15
30
James T D (32) 2006; 16
15
16
17
18
Yang C R (14) 2005; 15
19
Yagyu H (25) 2010; 49
Pal P (11) 2007; 17
1
2
3
4
Ciarlo D R (29) 1992; 2
6
7
9
Pal P (21) 2009; 19
Tanaka H (5) 2013
Pal P (13) 2012; 22
20
References_xml – ident: 2
  doi: 10.1109/T-ED.1978.19250
– ident: 28
  doi: 10.1007/s00542-004-0456-6
– volume: 17
  start-page: 2299
  issn: 0960-1317
  year: 2007
  ident: 11
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/17/11/017
– ident: 17
  doi: 10.1186/s40486-015-0009-z
– ident: 6
  doi: 10.1049/mnl.2014.0214
– ident: 20
  doi: 10.1016/j.sna.2014.05.011
– volume: 8
  start-page: 327
  issn: 0960-1317
  year: 1998
  ident: 31
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/8/4/011
– volume: 49
  issn: 0021-4922
  year: 2010
  ident: 25
  publication-title: Japan. J. Appl. Phys.
  doi: 10.1143/JJAP.49.096503
– volume: 19
  issn: 0960-1317
  year: 2009
  ident: 21
  publication-title: J. Micromech. Microeng.
– ident: 9
  doi: 10.1016/j.sna.2009.10.023
– ident: 15
  doi: 10.1016/S0924-4247(00)00317-4
– ident: 16
  doi: 10.1109/JMEMS.2009.2031688
– start-page: 1978
  year: 2013
  ident: 5
  publication-title: 17th Int. Conf. on Solid-State Sensors, Actuators and Microsystems Transducers and Eurosensors XXVII
  doi: 10.1109/Transducers.2013.6627183
– volume: 15
  start-page: 1174
  issn: 0960-1317
  year: 2005
  ident: 12
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/15/6/007
– volume: 2
  start-page: 10
  issn: 0960-1317
  year: 1992
  ident: 29
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/2/1/003
– ident: 7
  doi: 10.1016/0924-4247(92)80139-T
– volume: 15
  start-page: 2028
  issn: 0960-1317
  year: 2005
  ident: 14
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/15/11/006
– ident: 24
  doi: 10.1007/s00542-013-1859-z
– volume: 49
  issn: 0021-4922
  year: 2010
  ident: 8
  publication-title: Japan. J. Appl. Phys.
– volume: 16
  start-page: 2177
  issn: 0960-1317
  year: 2006
  ident: 32
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/16/10/034
– ident: 22
  doi: 10.1016/j.sna.2008.09.002
– ident: 3
  doi: 10.1149/1.2086277
– volume: 13
  start-page: 47
  issn: 0960-1317
  year: 2003
  ident: 26
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/13/1/307
– start-page: 650
  year: 1999
  ident: 10
  publication-title: Proc. 12th IEEE Micro-Electro-Mechanical Systems Conf.
  doi: 10.1109/MEMSYS.1999.746904
– ident: 1
  doi: 10.1063/1.1657233
– ident: 4
  doi: 10.1016/S0924-4247(01)00648-3
– ident: 30
  doi: 10.1016/0924-4247(96)80158-0
– volume: 22
  issn: 0960-1317
  year: 2012
  ident: 13
  publication-title: J. Micromech. Microeng.
– ident: 18
  doi: 10.1186/2213-9621-1-1
– ident: 23
  doi: 10.1016/j.sna.2010.12.018
– ident: 19
  doi: 10.1007/s00542-009-0956-5
– volume: 6
  start-page: 279
  issn: 0960-1317
  year: 1996
  ident: 27
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/6/2/011
SSID ssj0011818
Score 2.1940155
Snippet Micromirrors with a tilt angle of 45° are widely used in optical switching and interconnect applications which require 90° out of plane reflection. Silicon wet...
Micromirrors with a tilt angle of 45 degree are widely used in optical switching and interconnect applications which require 90 degree out of plane reflection....
SourceID proquest
crossref
iop
SourceType Aggregation Database
Enrichment Source
Index Database
Publisher
StartPage 25012
SubjectTerms Angle of reflection
Arrays
crystallographic directions
Etching
Planes
pre-etched patterns
Self alignment
Standard deviation
Wafers
Walls
wet etching
Title Precise identification of <1 0 0> directions on Si{0 0 1} wafer using a novel self-aligning pre-etched technique
URI https://iopscience.iop.org/article/10.1088/0960-1317/26/2/025012
https://www.proquest.com/docview/1825446099
Volume 26
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVIOP
  databaseName: IOP Science Platform
  customDbUrl:
  eissn: 1361-6439
  dateEnd: 99991231
  omitProxy: false
  ssIdentifier: ssj0011818
  issn: 0960-1317
  databaseCode: IOP
  dateStart: 19910101
  isFulltext: true
  titleUrlDefault: https://iopscience.iop.org/
  providerName: IOP Publishing
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV1bS8MwFA5eEPTBuzhvRPBJ6LZ2bZqCCCKKCF5ABd9CmiYyne1wm4oi-Orf9Jd4TpuOqYiID4FCLk2TnHzn9Jx8IWRD-4DRceSBWeIGjs_q3JEMBM-EAAYIOirnLTg6ZgcX_uFlcDlwir-Zte3WX4XHgii4GEIbEMdrqHQ7LuBezWM1r4YgjtcMjzY4GBd4hO_ktO9HAPzK9-KySnmG56dmPqHTMPTg2xad487-FJFlj4twk5tqrxtX1dMXMsf_fNI0mbRKKd0pys-QIZ3OkokBqsJZMpaHiqrOHHk8RUKMjqbNxEYa5ZNLM0O33PfXtzqmbVpgJS5qCplnzee6zXNf6IM0-o5iyP0VlTTN7nWLdnTLOGAUXOGPGorBKfmCSmifZXaeXOzvne8eOPb-Bkc1WL3rIHU9JN-PQpOA2gjGJDOgLkWKxyyWcSATLn2mgkQrl0sd8kCFnDVCF7UsoxoLZCTNUr1IqMQLckzClVboCOSR5AGTeAw2Rnodv0L8ct6EsuTmeMdGS-ROds4FDrHAIRYeE54ohrhCqv1q7YLd47cKmzCHwsp557fC9FPh69vbwWzRTkyFrJfLS4Bco7NGpjrrQctouoPsRNHSX965TMZBpbNx5StkpHvX06ugNnXjtVwyPgBOrQeR
linkProvider IOP Publishing
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV1Za9wwEB5y0NI-pEma0u2RKNCngNdrry3LUAqlyZI0RxfSQN6ELEsh7cZesrtNaAn0tX-zv6QztrzkoITSB4FBh-UZjb6RNfoE8MZEiNFZGuKyJIi9iHeEpzgank0QDAh0dMVbsH_At4-ij8fx8QxsTs_ClEM39bfxsSYKrkXoAuKET063FyDu-SH3Q59APAj9YW5nYT7uxgld4LDzqT_dS0AMq-bjplpzjudvTd1AqFnsxZ1pusKe3hMwTa_rkJOv7ck4a-vvtwgd__ezFmHBOafsfV1nCWZMsQyPr1EWLsODKmRUj57CZZ-IMUaGneYu4qhSMistexv8_vmrQ-kdqzGTBjfDzMPTHx2XF1yxC2XNOaPQ-xOmWFF-MwM2MgPr4eLghH7YMApSqQZWzqZssytw1Nv6_GHbc_c4eLrLO2OPKOwxRVGa2BzdR1xUcotuU6pFxjOVxSoXKuI6zo0OhDKJiHUieDcJyNuyuvsM5oqyMM-BKboox-ZCG00bgiJVIuaKjsNmRLMTtSBqdCe1IzmnuzYGstpsF0KSmCWJWYZchrIWcwva02rDmuXjvgobqEfp7H10X2F2o_CXs7Pr2RJ13IL1ZohJtG_atFGFKSfYMi3h0YbS9MW_vHMNHvY3e3Jv52D3JTxCL8-Fmr-CufH5xLxGT2qcrVaG8geHkAz7
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Precise+identification+of+%3C1+0+0%3E+directions+on+Si%7B0+0+1%7D+wafer+using+a+novel+self-aligning+pre-etched+technique&rft.jtitle=Journal+of+micromechanics+and+microengineering&rft.au=Singh%2C+S+S&rft.au=Veerla%2C+S&rft.au=Sharma%2C+V&rft.au=Pandey%2C+A+K&rft.date=2016-02-01&rft.issn=0960-1317&rft.eissn=1361-6439&rft.volume=26&rft.issue=2&rft.spage=25012&rft.epage=25016&rft_id=info:doi/10.1088%2F0960-1317%2F26%2F2%2F025012&rft.externalDBID=NO_FULL_TEXT
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0960-1317&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0960-1317&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0960-1317&client=summon