Modern Trends in Improving the Technical Characteristics of Devices and Systems for Digital Image Processing

The technology development greatly increases the amount of digital visual information. Existing devices cannot efficiently process such huge amounts of data. The technical characteristics of digital image processing (DIP) devices and systems are being actively improved to resolve this contradiction...

Full description

Saved in:
Bibliographic Details
Published inIEEE access Vol. 12; p. 1
Main Authors Nagornov, Nikolay N., Lyakhov, Pavel A., Bergerman, Maxim V., Kalita, Diana I.
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 01.01.2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text
ISSN2169-3536
2169-3536
DOI10.1109/ACCESS.2024.3381493

Cover

Abstract The technology development greatly increases the amount of digital visual information. Existing devices cannot efficiently process such huge amounts of data. The technical characteristics of digital image processing (DIP) devices and systems are being actively improved to resolve this contradiction in science and technology. The state-of-the-art methodology includes a huge number of very diverse approaches at the mathematical, software, and hardware implementation levels. We have analyzed all modern trends to improve the technical characteristics of DIP devices and systems. The main distinguishing feature of this review is that we are not limited to considering various aspects of neural network image processing, to which the vast majority of both review and research papers on the designated topic are devoted. Review papers on the subject under consideration are analyzed. Various mathematical and arithmetic-logical methods for improving the characteristics of image processing devices are described in detail. Original and significant architectural and structural solutions are analyzed. Promising neural network models of visual data processing are characterized. Hardware platforms for the design and operation of DIP systems that are efficient in terms of resource costs are considered. The most significant improvements achieved through the hardware implementation of models and methods on field-programmable gate arrays and application-specific integrated circuits are noted.
AbstractList The technology development greatly increases the amount of digital visual information. Existing devices cannot efficiently process such huge amounts of data. The technical characteristics of digital image processing (DIP) devices and systems are being actively improved to resolve this contradiction in science and technology. The state-of-the-art methodology includes a huge number of very diverse approaches at the mathematical, software, and hardware implementation levels. We have analyzed all modern trends to improve the technical characteristics of DIP devices and systems. The main distinguishing feature of this review is that we are not limited to considering various aspects of neural network image processing, to which the vast majority of both review and research papers on the designated topic are devoted. Review papers on the subject under consideration are analyzed. Various mathematical and arithmetic-logical methods for improving the characteristics of image processing devices are described in detail. Original and significant architectural and structural solutions are analyzed. Promising neural network models of visual data processing are characterized. Hardware platforms for the design and operation of DIP systems that are efficient in terms of resource costs are considered. The most significant improvements achieved through the hardware implementation of models and methods on field-programmable gate arrays and application-specific integrated circuits are noted.
Author Nagornov, Nikolay N.
Kalita, Diana I.
Lyakhov, Pavel A.
Bergerman, Maxim V.
Author_xml – sequence: 1
  givenname: Nikolay N.
  surname: Nagornov
  fullname: Nagornov, Nikolay N.
  organization: Department of Mathematical Modeling, North-Caucasus Federal University, Pushkin Str. 1, Stavropol, Russia
– sequence: 2
  givenname: Pavel A.
  surname: Lyakhov
  fullname: Lyakhov, Pavel A.
  organization: Department of Mathematical Modeling, North-Caucasus Federal University, Pushkin Str. 1, Stavropol, Russia
– sequence: 3
  givenname: Maxim V.
  surname: Bergerman
  fullname: Bergerman, Maxim V.
  organization: North-Caucasus Center for Mathematical Research, North-Caucasus Federal University, Pushkin Str. 1, Stavropol, Russia
– sequence: 4
  givenname: Diana I.
  surname: Kalita
  fullname: Kalita, Diana I.
  organization: Department of Mathematical Modeling, North-Caucasus Federal University, Pushkin Str. 1, Stavropol, Russia
BookMark eNplkc1qGzEUhYeSQtIkT5AuBF3bGf3OaBkmaWtIacDuWmikK1tmLLnSOMFvXzkTSmi1ueJyzgfnnk_VWYgBquoG13OMa3l713UPy-Wc1ITNKW0xk_RDdUGwkDPKqTh79z-vrnPe1uW1ZcWbi2r4ES2kgFYJgs3IB7TY7VN89mGNxg2gFZhN8EYPqNvopM0IyefRm4yiQ_fw7A1kpINFy2MeYZeRiwnd-7Ufi2Wx02tATykWUS7Eq-qj00OG67d5Wf36-rDqvs8ef35bdHePM0O5HGe9pRibFoSQgjgutWQt5dZxSykwSyQICw1mjlrSY26cwJhQqcsBuAVR08tqMXFt1Fu1T36n01FF7dXrIqa10qmEGEDxvnB1TxwRnHEQElzTsBab3jTAyYnFJtYh7PXxRQ_DXyCu1akApc0pnzoVoN4KKLYvk60c8_cB8qi28ZBCSa1ojXnNWl7joqKTyqSYcwL3H3sq91_258nlAeCdgzUtpw39A268oLU
CODEN IAECCG
Cites_doi 10.1007/s11831-021-09530-9
10.1109/tcsi.2020.3021397
10.1007/s00034-021-01671-3
10.3390/app122110771
10.1109/access.2020.3040366
10.3390/electronics11233966
10.1109/tcsii.2019.2922372
10.1016/j.neucom.2020.04.018
10.1109/jetcas.2019.2950386
10.1016/j.image.2018.07.007
10.1016/j.sysarc.2022.102765
10.1109/tnnls.2021.3110991
10.1109/tcsi.2021.3131581
10.1186/s40537-021-00444-8
10.1016/j.micpro.2021.104363
10.1109/tnnls.2020.3045492
10.3390/electronics7080135
10.1109/jetcas.2019.2933862
10.1109/access.2020.3038496
10.1109/tcsii.2022.3216516
10.1016/j.sysarc.2022.102561
10.1109/tcsi.2019.2951083
10.1109/tits.2022.3232231
10.1145/3524069
10.3390/electronics8060661
10.1109/access.2022.3151361
10.1145/3233300
10.1016/j.micpro.2022.104441
10.1016/j.jpdc.2022.04.025
10.1016/j.mejo.2022.105547
10.1049/cje.2020.11.002
10.1109/access.2022.3162066
10.1007/s11063-021-10458-1
10.1109/tcad.2019.2912894
10.1109/tc.2019.2926275
10.1109/les.2020.3009924
10.1016/j.micpro.2021.104270
10.1109/tcsii.2020.3015902
10.1109/tcad.2022.3179246
10.1109/tvlsi.2021.3060041
10.1109/tcsi.2018.2798595
10.1016/j.mejo.2021.105287
10.1109/tcsi.2021.3061766
10.1109/tcsi.2018.2856245
10.1016/j.sysarc.2021.102257
10.1109/access.2020.2995330
10.1109/tcsii.2019.2901060
10.1007/s11227-022-04415-5
10.1109/tcsii.2022.3199033
10.1109/tcsi.2018.2840092
10.1109/tcad.2020.2992527
10.3390/app10041223
10.1016/j.jksuci.2020.10.004
10.1109/tc.2021.3051627
10.1016/j.neucom.2022.02.071
10.1109/tcsi.2020.3019460
10.1109/tvlsi.2020.3046125
10.3390/s23042045
10.1007/s11227-020-03325-8
10.1109/tcsii.2021.3137987
10.1109/tvlsi.2019.2961602
10.1145/3524500
10.1109/access.2021.3121520
10.1109/access.2022.3233921
10.1109/tvlsi.2019.2941250
10.1109/access.2019.2946513
10.3390/jlpea11020023
10.1109/tnnls.2019.2899936
10.3390/jlpea11030032
10.1016/j.jpdc.2021.08.003
10.1016/j.aeue.2021.153825
10.1109/tcsi.2019.2892588
10.1109/tvlsi.2022.3196839
10.1016/j.sysarc.2019.01.007
10.3390/computers7030046
10.1109/tcsii.2022.3167022
10.3390/app122412633
10.1016/j.neucom.2017.09.046
10.1016/j.micpro.2020.103237
10.3390/app10249052
10.1109/mcas.2020.3027425
10.3390/electronics10091025
10.1016/j.micpro.2022.104624
10.1109/tvlsi.2019.2919609
10.1109/tvlsi.2019.2905242
10.1109/tcyb.2018.2823730
10.1109/tcsii.2020.2977015
10.1007/s00521-018-3761-1
10.1109/access.2020.2993506
10.1109/tcsii.2021.3098633
10.3390/a12080154
10.1109/access.2020.3047144
10.1016/j.sysarc.2021.102041
10.1016/j.sysarc.2020.101887
10.1109/access.2020.2992286
10.1109/tcad.2020.3012323
10.1109/access.2021.3050670
10.1109/access.2018.2890150
10.1109/tcad.2022.3158834
10.1109/tnnls.2021.3084250
10.1109/lsp.2023.3258863
10.1109/access.2019.2939781
10.1109/tnnls.2018.2815085
10.1109/tvlsi.2019.2945982
10.1109/access.2022.3230282
10.1109/access.2022.3194915
10.1109/tetc.2020.2997067
10.1109/tcad.2017.2778060
10.1109/tnnls.2020.3009047
ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024
DBID 97E
ESBDL
RIA
RIE
AAYXX
CITATION
7SC
7SP
7SR
8BQ
8FD
JG9
JQ2
L7M
L~C
L~D
ADTOC
UNPAY
DOA
DOI 10.1109/ACCESS.2024.3381493
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005–Present
IEEE Xplore Open Access Journals
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library (IEL)
CrossRef
Computer and Information Systems Abstracts
Electronics & Communications Abstracts
Engineered Materials Abstracts
METADEX
Technology Research Database
Materials Research Database
ProQuest Computer Science Collection
Advanced Technologies Database with Aerospace
Computer and Information Systems Abstracts – Academic
Computer and Information Systems Abstracts Professional
Unpaywall for CDI: Periodical Content
Unpaywall
DOAJ Directory of Open Access Journals
DatabaseTitle CrossRef
Materials Research Database
Engineered Materials Abstracts
Technology Research Database
Computer and Information Systems Abstracts – Academic
Electronics & Communications Abstracts
ProQuest Computer Science Collection
Computer and Information Systems Abstracts
Advanced Technologies Database with Aerospace
METADEX
Computer and Information Systems Abstracts Professional
DatabaseTitleList Materials Research Database


Database_xml – sequence: 1
  dbid: DOA
  name: DOAJ Directory of Open Access Journals
  url: https://www.doaj.org/
  sourceTypes: Open Website
– sequence: 2
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
– sequence: 3
  dbid: UNPAY
  name: Unpaywall
  url: https://proxy.k.utb.cz/login?url=https://unpaywall.org/
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2169-3536
EndPage 1
ExternalDocumentID oai_doaj_org_article_5bdf5ab2f26545e69ef77481cbc7e520
10.1109/access.2024.3381493
10_1109_ACCESS_2024_3381493
10478537
Genre orig-research
GrantInformation_xml – fundername: Ministry of Science and Higher Education of the Russian Federation
  grantid: 075-02-2023-938
  funderid: 10.13039/501100012190
– fundername: Russian Science Foundation
  grantid: 22-71-00009; 23-71-10013
  funderid: 10.13039/501100006769
GroupedDBID 0R~
5VS
6IK
97E
AAJGR
ABAZT
ABVLG
ACGFS
ADBBV
ALMA_UNASSIGNED_HOLDINGS
BCNDV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
EBS
ESBDL
GROUPED_DOAJ
IPLJI
JAVBF
KQ8
M43
M~E
O9-
OCL
OK1
RIA
RIE
RNS
4.4
AAYXX
AGSQL
CITATION
EJD
7SC
7SP
7SR
8BQ
8FD
JG9
JQ2
L7M
L~C
L~D
ADTOC
UNPAY
ID FETCH-LOGICAL-c359t-bd311c8e66962f59a94835df5d33e4d29e6de714f3d2b15cf611239a0245de603
IEDL.DBID UNPAY
ISSN 2169-3536
IngestDate Fri Oct 03 12:52:16 EDT 2025
Tue Aug 19 22:39:02 EDT 2025
Mon Jun 30 07:03:15 EDT 2025
Wed Oct 01 04:52:25 EDT 2025
Wed Aug 27 02:17:16 EDT 2025
IsDoiOpenAccess true
IsOpenAccess true
IsPeerReviewed true
IsScholarly true
Language English
License https://creativecommons.org/licenses/by-nc-nd/4.0
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c359t-bd311c8e66962f59a94835df5d33e4d29e6de714f3d2b15cf611239a0245de603
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0002-9423-3555
0000-0003-0487-4779
OpenAccessLink https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ielx7/6287639/6514899/10478537.pdf
PQID 3015048501
PQPubID 4845423
PageCount 1
ParticipantIDs ieee_primary_10478537
crossref_primary_10_1109_ACCESS_2024_3381493
doaj_primary_oai_doaj_org_article_5bdf5ab2f26545e69ef77481cbc7e520
proquest_journals_3015048501
unpaywall_primary_10_1109_access_2024_3381493
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2024-01-01
PublicationDateYYYYMMDD 2024-01-01
PublicationDate_xml – month: 01
  year: 2024
  text: 2024-01-01
  day: 01
PublicationDecade 2020
PublicationPlace Piscataway
PublicationPlace_xml – name: Piscataway
PublicationTitle IEEE access
PublicationTitleAbbrev Access
PublicationYear 2024
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References ref57
ref56
ref59
ref58
ref53
ref52
ref55
ref54
ref51
ref50
ref46
ref45
ref48
ref47
ref42
ref41
ref44
ref43
ref49
ref8
ref7
ref9
ref4
ref3
ref6
ref5
ref100
ref101
ref40
ref35
ref34
ref37
ref36
ref31
ref30
ref33
ref32
ref39
ref38
ref24
ref23
ref26
ref25
ref20
ref22
ref21
ref28
ref27
ref29
Sasikumar (ref106) 2022; 102
ref13
ref12
ref15
ref14
ref97
ref96
ref11
ref99
ref10
ref98
ref17
ref16
ref19
ref18
ref93
ref92
ref95
ref94
ref91
ref90
ref89
ref86
ref85
ref88
ref87
ref82
ref81
ref84
ref83
ref80
ref79
ref108
ref78
ref109
ref107
ref75
ref104
ref74
ref105
ref77
ref102
ref76
ref103
ref2
ref1
ref71
ref70
ref73
ref72
ref110
ref68
ref67
ref69
ref64
ref63
ref66
ref65
ref60
ref62
ref61
References_xml – ident: ref11
  doi: 10.1007/s11831-021-09530-9
– ident: ref8
  doi: 10.1109/tcsi.2020.3021397
– ident: ref46
  doi: 10.1007/s00034-021-01671-3
– ident: ref25
  doi: 10.3390/app122110771
– ident: ref50
  doi: 10.1109/access.2020.3040366
– ident: ref108
  doi: 10.3390/electronics11233966
– ident: ref110
  doi: 10.1109/tcsii.2019.2922372
– ident: ref33
  doi: 10.1016/j.neucom.2020.04.018
– ident: ref13
  doi: 10.1109/jetcas.2019.2950386
– ident: ref2
  doi: 10.1016/j.image.2018.07.007
– ident: ref97
  doi: 10.1016/j.sysarc.2022.102765
– ident: ref102
  doi: 10.1109/tnnls.2021.3110991
– ident: ref87
  doi: 10.1109/tcsi.2021.3131581
– ident: ref10
  doi: 10.1186/s40537-021-00444-8
– ident: ref72
  doi: 10.1016/j.micpro.2021.104363
– ident: ref93
  doi: 10.1109/tnnls.2020.3045492
– ident: ref35
  doi: 10.3390/electronics7080135
– ident: ref52
  doi: 10.1109/jetcas.2019.2933862
– ident: ref69
  doi: 10.1109/access.2020.3038496
– ident: ref30
  doi: 10.1109/tcsii.2022.3216516
– ident: ref7
  doi: 10.1016/j.sysarc.2022.102561
– ident: ref70
  doi: 10.1109/tcsi.2019.2951083
– ident: ref94
  doi: 10.1109/tits.2022.3232231
– ident: ref54
  doi: 10.1145/3524069
– ident: ref21
  doi: 10.3390/electronics8060661
– ident: ref37
  doi: 10.1109/access.2022.3151361
– ident: ref49
  doi: 10.1145/3233300
– ident: ref3
  doi: 10.1016/j.micpro.2022.104441
– ident: ref79
  doi: 10.1016/j.jpdc.2022.04.025
– ident: ref80
  doi: 10.1016/j.mejo.2022.105547
– ident: ref28
  doi: 10.1049/cje.2020.11.002
– ident: ref48
  doi: 10.1109/access.2022.3162066
– ident: ref19
  doi: 10.1007/s11063-021-10458-1
– ident: ref59
  doi: 10.1109/tcad.2019.2912894
– ident: ref43
  doi: 10.1109/tc.2019.2926275
– ident: ref78
  doi: 10.1109/les.2020.3009924
– ident: ref32
  doi: 10.1016/j.micpro.2021.104270
– ident: ref109
  doi: 10.1109/tcsii.2020.3015902
– ident: ref100
  doi: 10.1109/tcad.2022.3179246
– volume: 102
  year: 2022
  ident: ref106
  article-title: Reconfigurable and hardware efficient adaptive quantization model-based accelerator for binarized neural network
  publication-title: Comput. Electr. Eng.
– ident: ref62
  doi: 10.1109/tvlsi.2021.3060041
– ident: ref65
  doi: 10.1109/tcsi.2018.2798595
– ident: ref47
  doi: 10.1016/j.mejo.2021.105287
– ident: ref99
  doi: 10.1109/tcsi.2021.3061766
– ident: ref42
  doi: 10.1109/tcsi.2018.2856245
– ident: ref26
  doi: 10.1016/j.sysarc.2021.102257
– ident: ref56
  doi: 10.1109/access.2020.2995330
– ident: ref38
  doi: 10.1109/tcsii.2019.2901060
– ident: ref29
  doi: 10.1007/s11227-022-04415-5
– ident: ref103
  doi: 10.1109/tcsii.2022.3199033
– ident: ref77
  doi: 10.1109/tcsi.2018.2840092
– ident: ref76
  doi: 10.1109/tcad.2020.2992527
– ident: ref36
  doi: 10.3390/app10041223
– ident: ref5
  doi: 10.1016/j.jksuci.2020.10.004
– ident: ref74
  doi: 10.1109/tc.2021.3051627
– ident: ref81
  doi: 10.1016/j.neucom.2022.02.071
– ident: ref45
  doi: 10.1109/tcsi.2020.3019460
– ident: ref73
  doi: 10.1109/tvlsi.2020.3046125
– ident: ref82
  doi: 10.3390/s23042045
– ident: ref22
  doi: 10.1007/s11227-020-03325-8
– ident: ref101
  doi: 10.1109/tcsii.2021.3137987
– ident: ref64
  doi: 10.1109/tvlsi.2019.2961602
– ident: ref23
  doi: 10.1145/3524500
– ident: ref60
  doi: 10.1109/access.2021.3121520
– ident: ref34
  doi: 10.1109/access.2022.3233921
– ident: ref58
  doi: 10.1109/tvlsi.2019.2941250
– ident: ref44
  doi: 10.1109/access.2019.2946513
– ident: ref18
  doi: 10.3390/jlpea11020023
– ident: ref105
  doi: 10.1109/tnnls.2019.2899936
– ident: ref96
  doi: 10.3390/jlpea11030032
– ident: ref98
  doi: 10.1016/j.jpdc.2021.08.003
– ident: ref39
  doi: 10.1016/j.aeue.2021.153825
– ident: ref40
  doi: 10.1109/tcsi.2019.2892588
– ident: ref91
  doi: 10.1109/tvlsi.2022.3196839
– ident: ref12
  doi: 10.1016/j.sysarc.2019.01.007
– ident: ref67
  doi: 10.3390/computers7030046
– ident: ref57
  doi: 10.1109/tcsii.2022.3167022
– ident: ref89
  doi: 10.3390/app122412633
– ident: ref107
  doi: 10.1016/j.neucom.2017.09.046
– ident: ref41
  doi: 10.1016/j.micpro.2020.103237
– ident: ref53
  doi: 10.3390/app10249052
– ident: ref1
  doi: 10.1109/mcas.2020.3027425
– ident: ref27
  doi: 10.3390/electronics10091025
– ident: ref63
  doi: 10.1016/j.micpro.2022.104624
– ident: ref68
  doi: 10.1109/tvlsi.2019.2919609
– ident: ref31
  doi: 10.1109/tvlsi.2019.2905242
– ident: ref95
  doi: 10.1109/tcyb.2018.2823730
– ident: ref71
  doi: 10.1109/tcsii.2020.2977015
– ident: ref9
  doi: 10.1007/s00521-018-3761-1
– ident: ref85
  doi: 10.1109/access.2020.2993506
– ident: ref92
  doi: 10.1109/tcsii.2021.3098633
– ident: ref24
  doi: 10.3390/a12080154
– ident: ref88
  doi: 10.1109/access.2020.3047144
– ident: ref17
  doi: 10.1016/j.sysarc.2021.102041
– ident: ref6
  doi: 10.1016/j.sysarc.2020.101887
– ident: ref51
  doi: 10.1109/access.2020.2992286
– ident: ref61
  doi: 10.1109/tcad.2020.3012323
– ident: ref15
  doi: 10.1109/access.2021.3050670
– ident: ref20
  doi: 10.1109/access.2018.2890150
– ident: ref90
  doi: 10.1109/tcad.2022.3158834
– ident: ref104
  doi: 10.1109/tnnls.2021.3084250
– ident: ref55
  doi: 10.1109/lsp.2023.3258863
– ident: ref75
  doi: 10.1109/access.2019.2939781
– ident: ref83
  doi: 10.1109/tnnls.2018.2815085
– ident: ref84
  doi: 10.1109/tvlsi.2019.2945982
– ident: ref14
  doi: 10.1109/access.2022.3230282
– ident: ref4
  doi: 10.1109/access.2022.3194915
– ident: ref66
  doi: 10.1109/tetc.2020.2997067
– ident: ref86
  doi: 10.1109/tcad.2017.2778060
– ident: ref16
  doi: 10.1109/tnnls.2020.3009047
SSID ssj0000816957
Score 2.3024244
SecondaryResourceType review_article
Snippet The technology development greatly increases the amount of digital visual information. Existing devices cannot efficiently process such huge amounts of data....
SourceID doaj
unpaywall
proquest
crossref
ieee
SourceType Open Website
Open Access Repository
Aggregation Database
Index Database
Publisher
StartPage 1
SubjectTerms Application specific integrated circuits
ASIC
Data processing
Devices
Digital imaging
Electronics packaging
energy-efficient architecture
Field programmable gate arrays
FPGA
Hardware
hardware accelerator
High-performance computing
Image processing
Immersion plating
Integrated circuit modeling
low-area design
low-power device
neural network
Neural networks
Reviews
Trends
SummonAdditionalLinks – databaseName: DOAJ Directory of Open Access Journals
  dbid: DOA
  link: http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwrV1NT9wwELUQF-ihou0iUijyoceGjePvI90FrSqVE0jcLMcf1UqrgMqiin_P2PGusuqBC9cocibzJvabif0Goe9RaKZ8w2omJa2Zcr7uWCrka84tYY4Kmw44_74Rizv2657fj1p9pT1hgzzw4Lgp73zktmtjK2CxD0KHCIxFEdc5GXibs_VG6VEyledgRYTmssgMkUZPL2czeCNICFt2AWkZJAZ0ZynKiv2lxcoO2zx47h_tyz-7Wo0Wnusj9LEwRnw5WPoJ7YX-M_ow0hH8glZDRzM8bHDFyx5vawUYCB7O9fOEBp7t6jPjh4jnIU8W2PYeF_1yDEwWz5d_UkMRGAqmHFwOFMCIE3R3fXU7W9SljULtKNfruvOUEKeCEFq0kWsL6FAOXvWUBuZbHYQPkrBIfdsR7qIADka1TT9lfRANPUb7_UMfThCOVCX1HAc0IDJundIkSElIcL4LLDYV-rHxqHkc1DJMzjIabQYATALAFAAq9DN5fXtrkrrOFyAATAkA81YAVGiSMBs9j0ngILJCZxsQTfkunwxNBR6meEMqVG-B_c9Wm5tV7tj69T1sPUWHacyhhHOG9td_n8M3IDXr7jzH7yuEX_EL
  priority: 102
  providerName: Directory of Open Access Journals
– databaseName: IEEE Electronic Library (IEL)
  dbid: RIE
  link: http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LbxMxELZoL8CBFigitEU-cGTT9fq1PpaUqkKiJyr1ZnntMaqINlVJhODXM34kSkBI3FarlR_7je3PY883hLyLyog-tKIRWvNG9D40g0iOfCOlY8Jz5VKA8-drdXUjPt3K2xqsnmNhACBfPoNpesxn-WHhV8lVdpalZCTXe2RP96oEa20cKimDhJG6Kgux1pydz2bYCdwDdmKKOzHcC_Cd1SeL9NesKjsE8_FqvHc_f7j5fGutuTwg1-tWlism36ar5TD1v_4QcPzvbhySZ5V10vNiJs_JIxhfkKdbWoQvybxkRaPlkiy9G-nG30CRJNLsg0-I0tmuxjNdRHoBecKhbgy0aqBTZMP04u5rSkqCReG0RWtQApZ4RG4uP36ZXTU1FUPjuTTLZgicMd-DUkZ1URqHCHMZogycgwidARVAMxF56AYmfVTI47hx6WA3gGr5K7I_LkZ4TWjkfVLg8UglopDO94aB1oyBDwOI2E7I-zVE9r4obti8U2mNLYjahKitiE7IhwTj5tMkl51f4C-3dfRZOWBT3dDFTiFjBGUgIu3tmR-8BtlhnUcJpq36CkITcrK2ClvH9nfLk5NI9LJlE9JsLOWvtrqc8HKnrW_-Uc0xeZI-K56dE7K_fFjBKXKd5fA22_hvZ6H6kQ
  priority: 102
  providerName: IEEE
Title Modern Trends in Improving the Technical Characteristics of Devices and Systems for Digital Image Processing
URI https://ieeexplore.ieee.org/document/10478537
https://www.proquest.com/docview/3015048501
https://ieeexplore.ieee.org/ielx7/6287639/6514899/10478537.pdf
https://doaj.org/article/5bdf5ab2f26545e69ef77481cbc7e520
UnpaywallVersion publishedVersion
Volume 12
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVAFT
  databaseName: Open Access Digital Library
  customDbUrl:
  eissn: 2169-3536
  dateEnd: 99991231
  omitProxy: true
  ssIdentifier: ssj0000816957
  issn: 2169-3536
  databaseCode: KQ8
  dateStart: 20130101
  isFulltext: true
  titleUrlDefault: http://grweb.coalliance.org/oadl/oadl.html
  providerName: Colorado Alliance of Research Libraries
– providerCode: PRVAON
  databaseName: DOAJ Directory of Open Access Journals
  customDbUrl:
  eissn: 2169-3536
  dateEnd: 99991231
  omitProxy: true
  ssIdentifier: ssj0000816957
  issn: 2169-3536
  databaseCode: DOA
  dateStart: 20130101
  isFulltext: true
  titleUrlDefault: https://www.doaj.org/
  providerName: Directory of Open Access Journals
– providerCode: PRVHPJ
  databaseName: ROAD: Directory of Open Access Scholarly Resources
  customDbUrl:
  eissn: 2169-3536
  dateEnd: 99991231
  omitProxy: true
  ssIdentifier: ssj0000816957
  issn: 2169-3536
  databaseCode: M~E
  dateStart: 20130101
  isFulltext: true
  titleUrlDefault: https://road.issn.org
  providerName: ISSN International Centre
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1LbxMxELYgPUAPPIsILZEPHNlNvH7s-hhSqgqJigORysny2mMUNdpGkKjAr2fsdaIETnDbXVn2rGZsfzP2fEPIm6C0aPxEFKKueSEa54tWxEC-ltIy4biyMcH545W6nIsP1_I6B9xSLgwApMtnUMbHdJa_gOWPeqyqSJ6mxwq3eHQSxolXRvK6XPlwnxwpiVh8QI7mV5-mX2JFOaZ0wdPZ5Gkm1hzbVIMQncJKlOiaoXPAD7ajxNqfy6wcIM4Hm25lf97Z5XJv87l4TMxW7P7OyU25Wbel-_UHo-P__9cT8ijjUjrtDekpuQfdM3K8x1b4nCz7umm0v0ZLFx3dRSQowkiaovRR53R2yAJNbwM9h7QkUdt5mlnSKeJler74GsuWYFe4sNGctoA9npD5xfvPs8siF2soHJd6XbSeM-YaUEqrKkht0Qa49EF6zkH4SoPyUDMRuK9aJl1QiPS4tvHo14Oa8Bdk0N128JLQwJvI0eMQbAQhrWs0g7pmDJxvQYTJkLzd6sysek4Ok3yZiTbT2QwN10QVm6ziIXkX9bprGgm10wfUgcnz08gWRbVtFSqFmBKUhoDAuGGudTXICsc8iXrbG6_X0pCcbc3E5Nn_3fAYRhKNnLAhKXam85esvTkeyPrqH9ufkofxtY8JnZHB-tsGXiNKWrejFF0YpYTGUZ4WvwGFOQxH
linkProvider Unpaywall
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb9QwELagHAoHnkUsFPCBI9nG8SPxsWypFmj31Eq9WY49ripW2Qp2heDXM37saheExC2KEj_y2c43Y883hLwLSovO16ISbcsr0Tlf9SI68rWUlgnHlY0BzuczNb0Un6_kVQlWT7EwAJAOn8E4Xqa9fL9wq-gqO0pSMpK3d8k9KYSQOVxr41KJOSS0bIu2EKv10fFkgt1AK7ARY7TF0BrgO_-fJNNf8qrsUMz91XBrf_6w8_nW3-b0EZmt25kPmXwdr5b92P36Q8LxvzvymDwsvJMe54HyhNyB4Sl5sKVG-IzMc140mo_J0puBbjwOFGkiTV74iCmd7Ko800WgJ5CWHGoHT4sKOkU-TE9urmNaEiwKFy5awhKwxANyefrxYjKtSjKGynGpl1XvOWOuA6W0aoLUFjHm0gfpOQfhGw3KQ8tE4L7pmXRBIZPj2satXQ-q5s_J3rAY4AWhgXdRg8chmQhCWtdpBm3LGDjfgwj1iLxfQ2Rus-aGSbZKrU1G1ERETUF0RD5EGDePRsHsdAM_uSnzz8gem2r7JjQKOSMoDQGJb8dc71qQDdZ5EGHaqi8jNCKH61Fhyuz-bnh0E4lO1mxEqs1I-autNqW83Gnry39U85bsTy_Oz8zZp9mXV-R-fCX7eQ7J3vLbCl4j81n2b9J4_w2mkf3e
linkToUnpaywall http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1Lj9MwELage4A98Fy0ZRfkA0eSxvEj8bF0Wa2QWHGg0nKyHHuMKqpsBa14_HrGjlu1cIJbElm2o29sfzO2vyHkVVBatL4ShWgaXojW-aITMZCvpbRMOK5svOD8_lpdzcW7G3mTA27pLgwApMNnUMbHtJe_gOWPZqLqKJ6mJwqXeHQSJklXRvKmXPlwlxwpiVx8RI7m1x-mn2JGOaZ0wdPe5FkW1pzYlIMQncJalOiaoXPAD5ajpNqf06wcMM57m35lf363y-Xe4nP5kJhtt4czJ1_Kzbor3a8_FB3__78ekQeZl9LpYEiPyR3on5DjPbXCp2Q55E2jwzFauujpLiJBkUbSFKWPmNPZoQo0vQ30AtKURG3vaVZJp8iX6cXic0xbglXhxEbztQWs8YTML99-nF0VOVlD4bjU66LznDHXglJa1UFqizbApQ_Scw7C1xqUh4aJwH3dMemCQqbHtY1bvx5UxZ-RUX_bwymhgbdRo8ch2QhCWtdqBk3DGDjfgQjVmLzeYmZWgyaHSb5Mpc10NkPDNRFikyEekzcR113RKKidPiAGJo9PIzvsqu3qUCvklKA0BCTGLXOda0DW2OZJxG2vvQGlMTnfmonJo_-b4TGMJFpZsTEpdqbzV18Hczzo6_N_LH9G7sfXISZ0Tkbrrxt4gSxp3b3MQ-E3A0cKUQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Modern+Trends+in+Improving+the+Technical+Characteristics+of+Devices+and+Systems+for+Digital+Image+Processing&rft.jtitle=IEEE+access&rft.au=Nagornov%2C+Nikolay+N.&rft.au=Lyakhov%2C+Pavel+A.&rft.au=Bergerman%2C+Maxim+V.&rft.au=Kalita%2C+Diana+I.&rft.date=2024-01-01&rft.issn=2169-3536&rft.eissn=2169-3536&rft.volume=12&rft.spage=44659&rft.epage=44681&rft_id=info:doi/10.1109%2FACCESS.2024.3381493&rft.externalDBID=n%2Fa&rft.externalDocID=10_1109_ACCESS_2024_3381493
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2169-3536&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2169-3536&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2169-3536&client=summon