Eyeriss: An Energy-Efficient Reconfigurable Accelerator for Deep Convolutional Neural Networks

Eyeriss is an accelerator for state-of-the-art deep convolutional neural networks (CNNs). It optimizes for the energy efficiency of the entire system, including the accelerator chip and off-chip DRAM, for various CNN shapes by reconfiguring the architecture. CNNs are widely used in modern AI systems...

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Published inIEEE journal of solid-state circuits Vol. 52; no. 1; pp. 127 - 138
Main Authors Yu-Hsin Chen, Krishna, Tushar, Emer, Joel S., Sze, Vivienne
Format Journal Article
LanguageEnglish
Published New York IEEE 01.01.2017
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text
ISSN0018-9200
1558-173X
DOI10.1109/JSSC.2016.2616357

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Abstract Eyeriss is an accelerator for state-of-the-art deep convolutional neural networks (CNNs). It optimizes for the energy efficiency of the entire system, including the accelerator chip and off-chip DRAM, for various CNN shapes by reconfiguring the architecture. CNNs are widely used in modern AI systems but also bring challenges on throughput and energy efficiency to the underlying hardware. This is because its computation requires a large amount of data, creating significant data movement from on-chip and off-chip that is more energy-consuming than computation. Minimizing data movement energy cost for any CNN shape, therefore, is the key to high throughput and energy efficiency. Eyeriss achieves these goals by using a proposed processing dataflow, called row stationary (RS), on a spatial architecture with 168 processing elements. RS dataflow reconfigures the computation mapping of a given shape, which optimizes energy efficiency by maximally reusing data locally to reduce expensive data movement, such as DRAM accesses. Compression and data gating are also applied to further improve energy efficiency. Eyeriss processes the convolutional layers at 35 frames/s and 0.0029 DRAM access/multiply and accumulation (MAC) for AlexNet at 278 mW (batch size N = 4), and 0.7 frames/s and 0.0035 DRAM access/MAC for VGG-16 at 236 mW (N = 3).
AbstractList Eyeriss is an accelerator for state-of-the-art deep convolutional neural networks (CNNs). It optimizes for the energy efficiency of the entire system, including the accelerator chip and off-chip DRAM, for various CNN shapes by reconfiguring the architecture. CNNs are widely used in modern AI systems but also bring challenges on throughput and energy efficiency to the underlying hardware. This is because its computation requires a large amount of data, creating significant data movement from on-chip and off-chip that is more energy-consuming than computation. Minimizing data movement energy cost for any CNN shape, therefore, is the key to high throughput and energy efficiency. Eyeriss achieves these goals by using a proposed processing dataflow, called row stationary (RS), on a spatial architecture with 168 processing elements. RS dataflow reconfigures the computation mapping of a given shape, which optimizes energy efficiency by maximally reusing data locally to reduce expensive data movement, such as DRAM accesses. Compression and data gating are also applied to further improve energy efficiency. Eyeriss processes the convolutional layers at 35 frames/s and 0.0029 DRAM access/multiply and accumulation (MAC) for AlexNet at 278 mW (batch size N = 4), and 0.7 frames/s and 0.0035 DRAM access/MAC for VGG-16 at 236 mW (N = 3).
Eyeriss is an accelerator for state-of-the-art deep convolutional neural networks (CNNs). It optimizes for the energy efficiency of the entire system, including the accelerator chip and off-chip DRAM, for various CNN shapes by reconfiguring the architecture. CNNs are widely used in modern AI systems but also bring challenges on throughput and energy efficiency to the underlying hardware. This is because its computation requires a large amount of data, creating significant data movement from on-chip and off-chip that is more energy-consuming than computation. Minimizing data movement energy cost for any CNN shape, therefore, is the key to high throughput and energy efficiency. Eyeriss achieves these goals by using a proposed processing dataflow, called row stationary (RS), on a spatial architecture with 168 processing elements. RS dataflow reconfigures the computation mapping of a given shape, which optimizes energy efficiency by maximally reusing data locally to reduce expensive data movement, such as DRAM accesses. Compression and data gating are also applied to further improve energy efficiency. Eyeriss processes the convolutional layers at 35 frames/s and 0.0029 DRAM access/multiply and accumulation (MAC) for AlexNet at 278 mW (batch size [Formula Omitted]), and 0.7 frames/s and 0.0035 DRAM access/MAC for VGG-16 at 236 mW ([Formula Omitted]).
Author Yu-Hsin Chen
Krishna, Tushar
Sze, Vivienne
Emer, Joel S.
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  fullname: Sze, Vivienne
  organization: Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
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Cites_doi 10.1007/s11263-015-0816-y
10.1109/ISSCC.2016.7418007
10.1109/MICRO.2014.58
10.1109/ASAP.2009.25
10.1016/j.corsci.2014.11.041
10.1109/ISSCC.2015.7062935
10.1109/5.726791
10.1145/1815961.1815993
10.1038/nature14539
10.1145/2647868.2654889
10.1109/CVPR.2016.90
10.1038/nature16961
10.1109/ICCD.2013.6657019
10.1145/2742060.2743766
10.1145/2541940.2541967
10.1109/CVPRW.2014.106
10.1109/CVPR.2015.7298594
10.1145/1815961.1815968
10.1109/ISCAS.2010.5537907
10.1145/2749469.2750389
10.1109/FPT.2010.5681487
10.1109/ISSCC.2016.7418008
10.1109/CVPR.2014.81
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References ref13
ref12
ref15
ref36
ref14
ref30
han (ref33) 2015; 28
ref10
howard (ref34) 2010
horowitz (ref11) 2014
krizhevsky (ref2) 2012; 25
ref1
ref17
ref16
ref19
ref18
sermanet (ref7) 2013; abs 1312 6229
ref24
ref23
ref26
ref25
ref20
chen (ref29) 2016
ref28
daya (ref35) 2014
ref27
bojarski (ref8) 2016
zhang (ref21) 2015
ref9
conti (ref22) 2015
ref4
simonyan (ref3) 2014; abs 1409 1556
ref6
ref5
nair (ref31) 2010
chen (ref32) 2016
References_xml – start-page: 108
  year: 2010
  ident: ref34
  article-title: A 48-core IA-32 message-passing processor with DVFS in 45 nm CMOS
  publication-title: IEEE Int Solid-State Circuits Conf Dig Tech Papers (ISSCC)
– ident: ref27
  doi: 10.1007/s11263-015-0816-y
– start-page: 683
  year: 2015
  ident: ref22
  article-title: A ultra-low-energy convolution engine for fast brain-inspired vision in multicore clusters
  publication-title: Proc Design Autom Test Eur Conf Exhibit
– ident: ref36
  doi: 10.1109/ISSCC.2016.7418007
– volume: abs 1409 1556
  start-page: 1
  year: 2014
  ident: ref3
  article-title: Very deep convolutional networks for large-scale image recognition
  publication-title: CoRR
– ident: ref19
  doi: 10.1109/MICRO.2014.58
– ident: ref12
  doi: 10.1109/ASAP.2009.25
– start-page: 807
  year: 2010
  ident: ref31
  article-title: Rectified linear units improve restricted Boltzmann machines
  publication-title: Proc 27th Int Conf Mach Learn (ICML)
– volume: 25
  start-page: 1097
  year: 2012
  ident: ref2
  article-title: ImageNet classification with deep convolutional neural networks
  publication-title: Proc Adv Neural Inf Process Syst
– ident: ref20
  doi: 10.1016/j.corsci.2014.11.041
– ident: ref23
  doi: 10.1109/ISSCC.2015.7062935
– ident: ref26
  doi: 10.1109/5.726791
– ident: ref14
  doi: 10.1145/1815961.1815993
– ident: ref1
  doi: 10.1038/nature14539
– start-page: 25
  year: 2014
  ident: ref35
  article-title: SCORPIO: A 36-core research chip demonstrating snoopy coherence on a scalable mesh NoC with in-network ordering
  publication-title: Proc Ann Int Symp Comput Archit (ISCA)
– ident: ref28
  doi: 10.1145/2647868.2654889
– ident: ref5
  doi: 10.1109/CVPR.2016.90
– ident: ref9
  doi: 10.1038/nature16961
– start-page: 161
  year: 2015
  ident: ref21
  article-title: Optimizing FPGA-based accelerator design for deep convolutional neural networks
  publication-title: Proc ACM/SIGDA Int Symp Field-Program Gate Arrays
– ident: ref15
  doi: 10.1109/ICCD.2013.6657019
– ident: ref24
  doi: 10.1145/2742060.2743766
– start-page: 10
  year: 2014
  ident: ref11
  article-title: Computing's energy problem (and what we can do about it)
  publication-title: IEEE Int Solid-State Circuits Conf Dig Tech Papers (ISSCC)
– year: 2016
  ident: ref8
  article-title: End to end learning for self-driving cars
– volume: 28
  start-page: 1135
  year: 2015
  ident: ref33
  article-title: Learning both weights and connections for efficient neural network
  publication-title: Proc Adv Neural Inf Process Syst
– ident: ref17
  doi: 10.1145/2541940.2541967
– ident: ref16
  doi: 10.1109/CVPRW.2014.106
– year: 2016
  ident: ref29
  publication-title: An 1000-Class Image Classification Task Performed by the Eyeriss-Integrated Deep Learning System
– ident: ref4
  doi: 10.1109/CVPR.2015.7298594
– ident: ref10
  doi: 10.1145/1815961.1815968
– start-page: 367
  year: 2016
  ident: ref32
  article-title: Eyeriss: A spatial architecture for energy-efficient dataflow for convolutional neural networks
  publication-title: Proc Ann Int Symp Comput Archit (ISCA)
– volume: abs 1312 6229
  start-page: 1
  year: 2013
  ident: ref7
  article-title: OverFeat: Integrated recognition, localization and detection using convolutional networks
  publication-title: CoRR
– ident: ref30
  doi: 10.1109/ISCAS.2010.5537907
– ident: ref18
  doi: 10.1145/2749469.2750389
– ident: ref13
  doi: 10.1109/FPT.2010.5681487
– ident: ref25
  doi: 10.1109/ISSCC.2016.7418008
– ident: ref6
  doi: 10.1109/CVPR.2014.81
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Snippet Eyeriss is an accelerator for state-of-the-art deep convolutional neural networks (CNNs). It optimizes for the energy efficiency of the entire system,...
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SubjectTerms Artificial neural networks
Clocks
Computation
Computer architecture
Convolutional neural networks (CNNs)
Data compression
dataflow processing
deep learning
Energy costs
energy-efficient accelerators
Hardware
Neural networks
Random access memory
Shape
spatial architecture
Throughput
Title Eyeriss: An Energy-Efficient Reconfigurable Accelerator for Deep Convolutional Neural Networks
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