Characterization of Adhesion Force in MEMS at High Temperature Using Thermally Actuated Microstructures - Shavezipur, M.; Wenjuan Gou; Carraro, C.; Maboudian, R. (Journal of microelectromechanical systems, 2012)
Keywords: Adhesion; Adhesion force; Adhesion tests; Adhesives; Cantilever beams; Capillarity; Contact; Dimpling; Electrostatics; Exact sciences and technology; Finite element methods; finite element simulations; Force; General equipment and techniques; Gold; high-temperature micro- and nanoelectromechanical systems (M/NEMS); Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Landing; Mechanical instruments, equipment and techniques; microelectromechanical systems (MEMS) reliability; Micromechanical devices and systems; Microstructure; Optical surface waves; Physics; Quality control; Structural beams; Temperature measurement; thermal actuator; Transducers; Actuators; high-temperature micro- and nanoelectromechanical systems (M/NEMS); High temperature; microelectromechanical systems (MEMS) reliability; Cantilever beam; Finite element method; Thermal expansion coefficient; Modelling; Microelectromechanical device; Plates; Electrostatic force; Metering; Nanoelectromechanical device; Solid-solid interfaces; Experimental study; Adhesion; Contact surface; Adhesion force; Thermal transducer; Thermal activation; thermal actuator; finite element simulations; Polysilicon; Microstructure; Bilayers