APA (7th ed.) Citation

Shavezipur, M., Gou, W., Carraro, C., & Maboudian, R. (2012). Characterization of Adhesion Force in MEMS at High Temperature Using Thermally Actuated Microstructures. Journal of microelectromechanical systems, 21(3), 541-548. https://doi.org/10.1109/JMEMS.2012.2189363

Chicago Style (17th ed.) Citation

Shavezipur, M., Wenjuan Gou, C. Carraro, and R. Maboudian. "Characterization of Adhesion Force in MEMS at High Temperature Using Thermally Actuated Microstructures." Journal of Microelectromechanical Systems 21, no. 3 (2012): 541-548. https://doi.org/10.1109/JMEMS.2012.2189363.

MLA (9th ed.) Citation

Shavezipur, M., et al. "Characterization of Adhesion Force in MEMS at High Temperature Using Thermally Actuated Microstructures." Journal of Microelectromechanical Systems, vol. 21, no. 3, 2012, pp. 541-548, https://doi.org/10.1109/JMEMS.2012.2189363.