Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits - Wang, Chao; Huang, Xiao-Jie; Vafai, Kambiz (Applied thermal engineering, 2021)
Keywords: Computational fluid dynamics; Cooling effects; Correlation analysis; Fluid dynamics; Fluid flow; Heat conductivity; Heat transfer; Hotspot temperature; Integrated circuits; Interconnections; Local Nusselt number; Mathematical analysis; Multilayer Three-Dimensional chips; Multilayers; Reynolds numbers; Temperature; Temperature gradients; Thermal conductivity; Thermal interface material(TIM); Thermodynamic properties; Multilayer Three-Dimensional chips; Thermal interface material(TIM); Local Nusselt number; Reynolds numbers; Hotspot temperature