APA (7th ed.) Citation

Wang, C., Huang, X., & Vafai, K. (2021). Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits. Applied thermal engineering, 186, 116336. https://doi.org/10.1016/j.applthermaleng.2020.116336

Chicago Style (17th ed.) Citation

Wang, Chao, Xiao-Jie Huang, and Kambiz Vafai. "Analysis of Hotspots and Cooling Strategy for Multilayer Three-dimensional Integrated Circuits." Applied Thermal Engineering 186 (2021): 116336. https://doi.org/10.1016/j.applthermaleng.2020.116336.

MLA (9th ed.) Citation

Wang, Chao, et al. "Analysis of Hotspots and Cooling Strategy for Multilayer Three-dimensional Integrated Circuits." Applied Thermal Engineering, vol. 186, 2021, p. 116336, https://doi.org/10.1016/j.applthermaleng.2020.116336.