APA (7th ed.) Citation

Chen, J., Lau, J. H., Tzeng, P., Chen, S., Wu, C., Chen, C. C., . . . Kao, M. (2012). Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration. IEEE transactions on components, packaging, and manufacturing technology (2011), 2(6), 956-963. https://doi.org/10.1109/TCPMT.2011.2177663

Chicago Style (17th ed.) Citation

Chen, Jui-Chin, et al. "Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011) 2, no. 6 (2012): 956-963. https://doi.org/10.1109/TCPMT.2011.2177663.

MLA (9th ed.) Citation

Chen, Jui-Chin, et al. "Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011), vol. 2, no. 6, 2012, pp. 956-963, https://doi.org/10.1109/TCPMT.2011.2177663.