Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Preplated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests - Ping Zhao; Pecht, M.G.; Sungil Kang; Park, S. (IEEE transactions on components and packaging technologies, 2006)
Keywords: Circuit testing; Corrosion; Corrosion tests; Creep; Creep (materials); Creep corrosion; electrochemical migration; Electron optics; Gold; Lead; mixed flowing gas; Nickel; Optical microscopy; Packages; Packaging; Palladium; preplated leadframe; Printed circuits; Reflow soldering; Scanning electron microscopy