Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Preplated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests
Preplated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and mixed flowing gas environments to assess the quality and reliability due to these environmental conditions. Packages were tested as discrete parts and also as parts mounted o...
Saved in:
| Published in | IEEE transactions on components and packaging technologies Vol. 29; no. 4; pp. 818 - 826 |
|---|---|
| Main Authors | , , , |
| Format | Journal Article |
| Language | English |
| Published |
New York
IEEE
01.12.2006
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1521-3331 1557-9972 |
| DOI | 10.1109/TCAPT.2006.885962 |
Cover
| Abstract | Preplated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and mixed flowing gas environments to assess the quality and reliability due to these environmental conditions. Packages were tested as discrete parts and also as parts mounted onto printed circuit boards to assess the effect of reflow soldering. Selected packages with SnPb plated leadframes were tested for comparison purposes. After test exposure, optical microscopy, scanning electron microscope, and energy dispersive spectroscopy analyses were conducted to evaluate the corrosion behavior. Corrosion and creep corrosion on the leads were observed on all the preplated test samples subject to the mixed flowing gas. Creep corrosion over the mold compound surface was identified on the unmounted quad flat no-lead packages. The creep corrosion products were found to be electrically conductive and could bridge adjacent lead pairs |
|---|---|
| AbstractList | Preplated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and mixed flowing gas environments to assess the quality and reliability due to these environmental conditions. Packages were tested as discrete parts and also as parts mounted onto printed circuit boards to assess the effect of reflow soldering. Selected packages with SnPb plated leadframes were tested for comparison purposes. After test exposure, optical microscopy, scanning electron microscope, and energy dispersive spectroscopy analyses were conducted to evaluate the corrosion behavior. Corrosion and creep corrosion on the leads were observed on all the preplated test samples subject to the mixed flowing gas. Creep corrosion over the mold compound surface was identified on the unmounted quad flat no-lead packages. The creep corrosion products were found to be electrically conductive and could bridge adjacent lead pairs |
| Author | Park, S. Ping Zhao Sungil Kang Pecht, M.G. |
| Author_xml | – sequence: 1 surname: Ping Zhao fullname: Ping Zhao organization: Dept. of Mech. Eng., Maryland Univ., College Park, MD – sequence: 2 givenname: M.G. surname: Pecht fullname: Pecht, M.G. organization: Dept. of Mech. Eng., Maryland Univ., College Park, MD – sequence: 3 surname: Sungil Kang fullname: Sungil Kang – sequence: 4 givenname: S. surname: Park fullname: Park, S. |
| BookMark | eNp9kcFu1DAQhiNUJNrCA1RcLC5wya4d24lzjFZtQdrSSF3OlmOPFy9JvNiJCk_Aa-PdrUDqoaeZkb7_H3v-i-xs9CNk2RXBC0JwvdysmnazKDAuF0LwuixeZeeE8yqv66o4O_QFySml5E12EeMOY8IEq8-zP02MEOMA44S8RV_dsjXLZs5bg9Ro_s_NFrUB9r2awKA1KGODGgC1Sv9QW4joYe52oCc0eXTdpyZ4_R0Gp1WP7tw2qMn58eh4534lh5veP7pxi25VRBuIU3ybvbaqj_DuqV5m326uN6vP-fr-9suqWeea8mrKaVlSQzlWFVgubGeMJRzXNbWm0DWvKKNMM112SnWVgaKwnWZCc7C2pKrr6GX28eS7D_7nnDbLwUUNfa9G8HOUIp0Ol0SIRH56kSQVJlgUtaAJ_fAM3fk5jOkfUqQHC8Y4SRA5QTr4GANYuQ9uUOG3JFgeMpTHDOUhQ3nKMGmqZxrtpuMtp6Bc_6Ly_UnpAODfJoZJWTBC_wJUNauS |
| CODEN | ITCPFB |
| CitedBy_id | crossref_primary_10_1115_1_4051255 crossref_primary_10_1016_j_microrel_2014_01_003 crossref_primary_10_1007_s10800_014_0686_y crossref_primary_10_1016_j_engfailanal_2011_07_003 crossref_primary_10_2139_ssrn_4105285 crossref_primary_10_1016_j_calphad_2022_102492 crossref_primary_10_1016_j_electacta_2013_10_051 crossref_primary_10_1016_j_microrel_2019_04_012 |
| Cites_doi | 10.1109/TEPM.2004.843150 10.1109/33.2959 10.1109/6144.759358 10.1115/1.1646425 10.1109/33.83945 10.1109/33.2960 10.1016/S0026-2714(03)00064-7 10.1088/0034-4885/68/4/R03 10.1109/TCHMT.1982.1135979 10.1109/TPHP.1975.1135058 10.5006/1.3585165 10.1109/TDMR.2005.846981 10.1149/1.2127628 |
| ContentType | Journal Article |
| Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2006 |
| Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2006 |
| DBID | 97E RIA RIE AAYXX CITATION 7SE 7SP 8FD F28 FR3 JG9 L7M |
| DOI | 10.1109/TCAPT.2006.885962 |
| DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005–Present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library (IEL) CrossRef Corrosion Abstracts Electronics & Communications Abstracts Technology Research Database ANTE: Abstracts in New Technology & Engineering Engineering Research Database Materials Research Database Advanced Technologies Database with Aerospace |
| DatabaseTitle | CrossRef Materials Research Database Technology Research Database Electronics & Communications Abstracts Engineering Research Database Corrosion Abstracts Advanced Technologies Database with Aerospace ANTE: Abstracts in New Technology & Engineering |
| DatabaseTitleList | Materials Research Database Materials Research Database |
| Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISSN | 1557-9972 |
| EndPage | 826 |
| ExternalDocumentID | 2346498481 10_1109_TCAPT_2006_885962 4016241 |
| Genre | orig-research |
| GroupedDBID | -~X 0R~ 29I 4.4 5GY 5VS 6IK 85S 97E AAJGR AASAJ AAWTH ABAZT ABQJQ ABVLG ACGFO ACIWK AETIX AGQYO AGSQL AHBIQ AI. AIBXA ALLEH ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD HZ~ H~9 IFIPE IFJZH IPLJI JAVBF LAI M43 O9- OCL RIA RIE RNS VH1 VJK AAYXX CITATION RIG 7SE 7SP 8FD F28 FR3 JG9 L7M |
| ID | FETCH-LOGICAL-c357t-3663d350a7ef58fbddf150993fd2c9573434c4c6baab7de22fbc48c5eff63abb3 |
| IEDL.DBID | RIE |
| ISSN | 1521-3331 |
| IngestDate | Thu Sep 04 18:43:29 EDT 2025 Fri Sep 05 00:40:33 EDT 2025 Sun Jun 29 13:20:51 EDT 2025 Thu Apr 24 23:01:11 EDT 2025 Tue Jul 01 03:39:47 EDT 2025 Tue Aug 26 16:34:41 EDT 2025 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 4 |
| Language | English |
| License | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c357t-3663d350a7ef58fbddf150993fd2c9573434c4c6baab7de22fbc48c5eff63abb3 |
| Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 content type line 23 ObjectType-Article-2 ObjectType-Feature-1 |
| PQID | 866384451 |
| PQPubID | 23500 |
| PageCount | 9 |
| ParticipantIDs | ieee_primary_4016241 proquest_miscellaneous_1701082983 crossref_primary_10_1109_TCAPT_2006_885962 crossref_citationtrail_10_1109_TCAPT_2006_885962 proquest_miscellaneous_896206188 proquest_journals_866384451 |
| ProviderPackageCode | CITATION AAYXX |
| PublicationCentury | 2000 |
| PublicationDate | 2006-12-01 |
| PublicationDateYYYYMMDD | 2006-12-01 |
| PublicationDate_xml | – month: 12 year: 2006 text: 2006-12-01 day: 01 |
| PublicationDecade | 2000 |
| PublicationPlace | New York |
| PublicationPlace_xml | – name: New York |
| PublicationTitle | IEEE transactions on components and packaging technologies |
| PublicationTitleAbbrev | TCAPT |
| PublicationYear | 2006 |
| Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| References | (ref23) 2000 ref15 ref14 romm (ref9) 1998 benedetto (ref13) 1998 (ref25) 2003 ref17 ref18 pecht (ref1) 1994 (ref22) 1990 romm (ref8) 1994 ref24 stastna (ref20) 1977 ref26 abbott (ref12) 2002 ganesan (ref4) 2004 ref21 ref28 ref27 (ref19) 2003 pecht (ref2) 1993 ref7 ref3 ref6 romm (ref11) 2001 ref5 abbott (ref10) 1998 xie (ref16) 2001; 10 |
| References_xml | – ident: ref3 doi: 10.1109/TEPM.2004.843150 – year: 1993 ident: ref2 publication-title: Soldering Processes and Equipment – year: 2003 ident: ref19 publication-title: Texas Instruments Logic Devices Now 100% Lead-Free – ident: ref24 doi: 10.1109/33.2959 – ident: ref7 doi: 10.1109/6144.759358 – ident: ref17 doi: 10.1115/1.1646425 – year: 1994 ident: ref1 publication-title: Plastic Encapsulated Microelectronics – ident: ref6 doi: 10.1109/33.83945 – year: 2003 ident: ref25 article-title: standard guide for mixed flowing gas (mfg) tests for electrical contacts publication-title: Amer Soc Testing Mater – start-page: 7 year: 2002 ident: ref12 article-title: lead-free components finishes: 260c reflow temperatures and mold compound adhesion publication-title: IPC Rev – year: 2000 ident: ref23 publication-title: Electrochemical Migration Resistance Test – year: 1990 ident: ref22 publication-title: Surface Insulation Resistance Handbook – ident: ref28 doi: 10.1109/33.2960 – ident: ref14 doi: 10.1016/S0026-2714(03)00064-7 – ident: ref27 doi: 10.1088/0034-4885/68/4/R03 – ident: ref21 doi: 10.1109/TCHMT.1982.1135979 – ident: ref5 doi: 10.1109/TPHP.1975.1135058 – ident: ref26 doi: 10.5006/1.3585165 – year: 2001 ident: ref11 publication-title: Evaluation of Nickel/Palladium/Gold-finished Surface Mount Integrated Circuits – start-page: 624 year: 1998 ident: ref13 article-title: solderability and board-level reliability of palladium-plated, fine-pitch components publication-title: Proc Surface Mount Int Conf Exhibition – start-page: 589 year: 1977 ident: ref20 article-title: silver migration in plastic ics publication-title: Proc 4th Symp Rel Electron (Relectronic'77) – year: 1994 ident: ref8 publication-title: Palladium Lead Finish User's Manual – year: 2004 ident: ref4 publication-title: Lead-Free Electronics – year: 1998 ident: ref10 publication-title: Shelf-Life Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits – volume: 10 start-page: 39 year: 2001 ident: ref16 article-title: palladium-plated packages: creep corrosion and its impact on reliability publication-title: Adv Packag – ident: ref18 doi: 10.1109/TDMR.2005.846981 – year: 1998 ident: ref9 publication-title: Steam-age Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits – ident: ref15 doi: 10.1149/1.2127628 |
| SSID | ssj0014849 |
| Score | 1.7249582 |
| Snippet | Preplated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and mixed flowing gas environments to... |
| SourceID | proquest crossref ieee |
| SourceType | Aggregation Database Enrichment Source Index Database Publisher |
| StartPage | 818 |
| SubjectTerms | Circuit testing Corrosion Corrosion tests Creep Creep (materials) Creep corrosion electrochemical migration Electron optics Gold Lead mixed flowing gas Nickel Optical microscopy Packages Packaging Palladium preplated leadframe Printed circuits Reflow soldering Scanning electron microscopy |
| Title | Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Preplated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests |
| URI | https://ieeexplore.ieee.org/document/4016241 https://www.proquest.com/docview/866384451 https://www.proquest.com/docview/1701082983 https://www.proquest.com/docview/896206188 |
| Volume | 29 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb9QwEB6VnuDAqyBCARmJEyK7WT8S7zGqulRIW-WwlXqL4le16iqpmkRF_AH-NmMnG96IW6I4tpMZez57PN8AvEOroQ2nOk4So2JuhMB5kGaxQNNtF9am2gS2z_P07IJ_uhSXB_BhioWx1obDZ3bmL4Mv3zS691tlc1wLpNRHqd9DNRtitSaPAZcB6npzFDPGFqMHc5Es55uTvNgMfgcpfbaZn2xQSKry20wczMvqEaz3HRtOlVzP-k7N9JdfOBv_t-eP4eGIM0k-KMYTOLD1U3jwA_vgEXzNJ1ZO0jhyvp0XZp73cWFIVZvv9_kVKW7tzQ5RqSE-JafzB7pIUelrnIxagnOP38whXUNOh6Q6emQhIOvt1aBhocb19jPWsNo1d9g--Vi1ZIN_on0GF6vTzclZPOZliDUTWRczRCmGiaTKrBPSKWMcwkoEOs5QvRQZ44xrrlNVVSozllKnNJdaWOdSVinFnsNh3dT2BRCVpQKLcYQNlCslKpMwrI9mUjOLWC6CZC-pUo-k5T53xq4Mi5dkWQbh-mSaaTkIN4L30ys3A2PHvwofeWFNBUc5RXC8V4dyHNNtKfGzpedzi-Dt9BQHo_ewVLVt-rb05PY-WFmyCMhfykhsFkGUlC__3PYx3KdjcqRk8QoOu9vevkbg06k3QeO_AbV4_4g |
| linkProvider | IEEE |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb5wwEB5F6aHtoa-0Ck0frtRTVXZZbIP3iKJst212xYFIuSH8IFplBVEAJeof6N_u2LD0XfUGwtiGGc989tjfALxFr6E0C5UfBFr6THOOdjCMfY6u28yMiZR2bJ_raHnGPp3z8z14P56FMca4zWdmYi9dLF_XqrNLZVOcC0ShPaV-h-OsQvSntcaYARMO7FqH5FNKZ0MMcxbMp9lxkmZ95EEIm2_mJy_k0qr8Zoudg1k8hNWua_2-kstJ18qJ-vILa-P_9v0RPBiQJkl61XgMe6Z6Avd_4B88gK_JyMtJ6pKsN9NUT5POTzUpKv39Prkg6bW52iIu1cQm5Sztli6SFuoSzVFD0PrY5RzS1uSkT6ujBh4Cstpc9DrmalxtbrGGxba-wfbJh6IhGf6J5imcLU6y46U_ZGbwFeVx61PEKZryoIhNyUUptS4RWCLUKXWo5jymjDLFVCSLQsbahGEpFROKm7KMaCElfQb7VV2ZQyAyjjgWYwgcQiYlL3RAsb4wFooaRHMeBDtJ5WqgLbfZM7a5m74E89wJ16bTjPJeuB68G1-56jk7_lX4wAprLDjIyYOjnTrkw6hucoGfLSyjmwdvxqc4HG2MpahM3TW5pbe3x5UF9YD8pYzAZhFGCfH8z22_hrvLbHWan35cfz6Ce-GQKimYvYD99rozLxEGtfKV0_5vR4kC6g |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Assessment+of+Ni%2FPd%2FAu-Pd+and+Ni%2FPd%2FAu-Ag+Preplated+Leadframe+Packages+Subject+to+Electrochemical+Migration+and+Mixed+Flowing+Gas+Tests&rft.jtitle=IEEE+transactions+on+components+and+packaging+technologies&rft.au=Ping+Zhao%2C+Ping+Zhao&rft.au=Pecht%2C+M.G&rft.au=Sungil+Kang%2C+Sungil+Kang&rft.au=Park%2C+S&rft.date=2006-12-01&rft.pub=The+Institute+of+Electrical+and+Electronics+Engineers%2C+Inc.+%28IEEE%29&rft.issn=1521-3331&rft.eissn=1557-9972&rft.volume=29&rft.issue=4&rft.spage=818&rft_id=info:doi/10.1109%2FTCAPT.2006.885962&rft.externalDBID=NO_FULL_TEXT&rft.externalDocID=2346498481 |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1521-3331&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1521-3331&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1521-3331&client=summon |