Wafer size effect on material removal rate in copper CMP process - Yuh, Minjong; Jang, Soocheon; Park, Inho; Jeong, Haedo (Journal of mechanical science and technology, 2017)
Keywords: Chemical etching; Chemical-mechanical polishing; Control; Copper; Dynamical Systems; Electromigration; Engineering; Industrial and Production Engineering; Infrared detectors; Manufacturing; Material removal rate (machining); Mechanical Engineering; Piezoelectricity; Size effects; Sliding; Vibration; 기계공학; Dynamic etch rate; Chemical mechanical planarization (CMP); Wafer size; Thermal effect; Copper; Material removal rate (MRR)