APA (7th ed.) Citation

Eleffendi, M. A., & Johnson, C. M. (2017). In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages. IEEE transactions on power electronics, 32(9), 7187-7198. https://doi.org/10.1109/TPEL.2016.2628705

Chicago Style (17th ed.) Citation

Eleffendi, Mohd Amir, and C. Mark Johnson. "In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages." IEEE Transactions on Power Electronics 32, no. 9 (2017): 7187-7198. https://doi.org/10.1109/TPEL.2016.2628705.

MLA (9th ed.) Citation

Eleffendi, Mohd Amir, and C. Mark Johnson. "In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages." IEEE Transactions on Power Electronics, vol. 32, no. 9, 2017, pp. 7187-7198, https://doi.org/10.1109/TPEL.2016.2628705.