Model free kinetics coupled with finite element method for curing simulation of thermosetting epoxy resins

ABSTRACT A finite element method algorithm for epoxy curing degree simulation was developed in Abaqus by integrating the discretized analytical solution of the model free kinetics into its user subroutines. This method was verified by nonisothermal and isothermal DSC experiments of an epoxy resin. B...

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Bibliographic Details
Published inJournal of applied polymer science Vol. 135; no. 27
Main Authors Tao, Qi, Pinter, Gerald, Antretter, Thomas, Krivec, Thomas, Fuchs, Peter
Format Journal Article
LanguageEnglish
Published Hoboken Wiley Subscription Services, Inc 15.07.2018
Subjects
Computer simulation
Curing
differential scanning calorimetry (DSC)
Epoxy resins
Finite element analysis
Finite element method
kinetics
Materials science
Mathematical analysis
Nonlinear programming
Polymers
Subroutines
Temperature distribution
theory and modeling
thermosets
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ISSN0021-8995
1097-4628
DOI10.1002/app.46408

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Summary:ABSTRACT A finite element method algorithm for epoxy curing degree simulation was developed in Abaqus by integrating the discretized analytical solution of the model free kinetics into its user subroutines. This method was verified by nonisothermal and isothermal DSC experiments of an epoxy resin. By means of this method, the real manufacturing press cycle could be simulated regarding temperature distribution and curing degree with advanced curing degree‐dependent material properties. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46408.
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ISSN:0021-8995
1097-4628
DOI:10.1002/app.46408