Single-Event Burnout Mechanisms in SiC Power MOSFETs

Heavy ion-induced single-event burnout (SEB) is investigated in high-voltage silicon carbide power MOSFETs. Experimental data for 1200-V SiC power MOSFETs show a significant decrease in SEB onset voltage for particle linear energy transfers greater than 10 MeV/cm 2 /mg, above which the SEB threshold...

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Published inIEEE transactions on nuclear science Vol. 65; no. 8; pp. 1951 - 1955
Main Authors Witulski, Arthur F., Ball, Dennis R., Galloway, Kenneth F., Javanainen, Arto, Lauenstein, Jean-Marie, Sternberg, Andrew L., Schrimpf, Ronald D.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.08.2018
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN0018-9499
1558-1578
1558-1578
DOI10.1109/TNS.2018.2849405

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Abstract Heavy ion-induced single-event burnout (SEB) is investigated in high-voltage silicon carbide power MOSFETs. Experimental data for 1200-V SiC power MOSFETs show a significant decrease in SEB onset voltage for particle linear energy transfers greater than 10 MeV/cm 2 /mg, above which the SEB threshold voltage is nearly constant at half of the rated maximum operating voltage for these devices. TCAD simulations show a parasitic bipolar junction transistor turn-on mechanism, which drives the avalanching of carriers and leads to runaway drain current, resulting in SEB.
AbstractList Heavy ion-induced single-event burnout (SEB) is investigated in high-voltage silicon carbide power MOSFETs. Experimental data for 1200-V SiC power MOSFETs show a significant decrease in SEB onset voltage for particle linear energy transfers greater than 10 MeV/cm2/mg, above which the SEB threshold voltage is nearly constant at half of the rated maximum operating voltage for these devices. TCAD simulations show a parasitic bipolar junction transistor turn-on mechanism, which drives the avalanching of carriers and leads to runaway drain current, resulting in SEB.
Heavy ion-induced single-event burnout (SEB) is investigated in high-voltage silicon carbide power MOSFETs. Experimental data for 1200-V SiC power MOSFETs show a significant decrease in SEB onset voltage for particle linear energy transfers greater than 10 MeV/cm 2 /mg, above which the SEB threshold voltage is nearly constant at half of the rated maximum operating voltage for these devices. TCAD simulations show a parasitic bipolar junction transistor turn-on mechanism, which drives the avalanching of carriers and leads to runaway drain current, resulting in SEB.
Author Sternberg, Andrew L.
Lauenstein, Jean-Marie
Ball, Dennis R.
Javanainen, Arto
Witulski, Arthur F.
Galloway, Kenneth F.
Schrimpf, Ronald D.
Author_xml – sequence: 1
  givenname: Arthur F.
  orcidid: 0000-0002-0441-5444
  surname: Witulski
  fullname: Witulski, Arthur F.
  email: arthur.f.witulski@vanderbilt.edu
  organization: Department of Electrical Engineering and Computer Science, Institute for Space and Defense Electronics, Vanderbilt University, Nashville, TN, USA
– sequence: 2
  givenname: Dennis R.
  orcidid: 0000-0003-0411-1835
  surname: Ball
  fullname: Ball, Dennis R.
  organization: Department of Electrical Engineering and Computer Science, Institute for Space and Defense Electronics, Vanderbilt University, Nashville, TN, USA
– sequence: 3
  givenname: Kenneth F.
  surname: Galloway
  fullname: Galloway, Kenneth F.
  organization: Department of Electrical Engineering and Computer Science, Institute for Space and Defense Electronics, Vanderbilt University, Nashville, TN, USA
– sequence: 4
  givenname: Arto
  orcidid: 0000-0001-7906-3669
  surname: Javanainen
  fullname: Javanainen, Arto
  organization: Department of Electrical Engineering and Computer Science, Institute for Space and Defense Electronics, Vanderbilt University, Nashville, TN, USA
– sequence: 5
  givenname: Jean-Marie
  surname: Lauenstein
  fullname: Lauenstein, Jean-Marie
  organization: NASA Goddard Space Flight Center, Greenbelt, MD, USA
– sequence: 6
  givenname: Andrew L.
  surname: Sternberg
  fullname: Sternberg, Andrew L.
  organization: Department of Electrical Engineering and Computer Science, Institute for Space and Defense Electronics, Vanderbilt University, Nashville, TN, USA
– sequence: 7
  givenname: Ronald D.
  surname: Schrimpf
  fullname: Schrimpf, Ronald D.
  organization: Department of Electrical Engineering and Computer Science, Institute for Space and Defense Electronics, Vanderbilt University, Nashville, TN, USA
BookMark eNptkM1PAjEQxRuDiYDeTbxs4nmxn9v2qAQ_EhCTxfOmW4qWLF1sdyX895Ys4UA8TWbm_V7mzQD0XO0MALcIjhCC8mHxno8wRGKEBZUUsgvQR4yJFDEueqAP4yqVVMorMAhhHVvKIOsDmlv3VZl08mtckzy13tVtk8yM_lbOhk1IrEtyO04-6p3xyWyeP08W4RpcrlQVzM2xDsFnHI9f0-n85W38OE01IaRJGZeMEE2oMGRJSEllWTKDsEaGrQThRmRLaRTOMo6XcsmV0lxogTgXKtOsJEOAOt_WbdV-p6qq2Hq7UX5fIFgcYheNC8UhdnGMHZn7jtn6-qc1oSnWdUwVz4w6CQWmFPOoyjqV9nUI3qwKbRvV2No1XtnqZB-_em4Pz8Dzi_5B7jrEGmNOckEkphCTP9RPgHs
CODEN IETNAE
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ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2018
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2018
DBID 97E
RIA
RIE
AAYXX
CITATION
7QF
7QL
7QQ
7SC
7SE
7SP
7SR
7T7
7TA
7TB
7U5
7U9
8BQ
8FD
C1K
F28
FR3
H8D
H94
JG9
JQ2
KR7
L7M
L~C
L~D
M7N
P64
ADTOC
UNPAY
DOI 10.1109/TNS.2018.2849405
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005-present
IEEE All-Society Periodicals Package (ASPP) 1998-Present
IEEE Electronic Library (IEL)
CrossRef
Aluminium Industry Abstracts
Bacteriology Abstracts (Microbiology B)
Ceramic Abstracts
Computer and Information Systems Abstracts
Corrosion Abstracts
Electronics & Communications Abstracts
Engineered Materials Abstracts
Industrial and Applied Microbiology Abstracts (Microbiology A)
Materials Business File
Mechanical & Transportation Engineering Abstracts
Solid State and Superconductivity Abstracts
Virology and AIDS Abstracts
METADEX
Technology Research Database
Environmental Sciences and Pollution Management
ANTE: Abstracts in New Technology & Engineering
Engineering Research Database
Aerospace Database
AIDS and Cancer Research Abstracts
Materials Research Database
ProQuest Computer Science Collection
Civil Engineering Abstracts
Advanced Technologies Database with Aerospace
Computer and Information Systems Abstracts – Academic
Computer and Information Systems Abstracts Professional
Algology Mycology and Protozoology Abstracts (Microbiology C)
Biotechnology and BioEngineering Abstracts
Unpaywall for CDI: Periodical Content
Unpaywall
DatabaseTitle CrossRef
Materials Research Database
Technology Research Database
Computer and Information Systems Abstracts – Academic
Mechanical & Transportation Engineering Abstracts
ProQuest Computer Science Collection
Computer and Information Systems Abstracts
Materials Business File
Environmental Sciences and Pollution Management
Aerospace Database
Engineered Materials Abstracts
Bacteriology Abstracts (Microbiology B)
Algology Mycology and Protozoology Abstracts (Microbiology C)
AIDS and Cancer Research Abstracts
Industrial and Applied Microbiology Abstracts (Microbiology A)
Advanced Technologies Database with Aerospace
ANTE: Abstracts in New Technology & Engineering
Civil Engineering Abstracts
Aluminium Industry Abstracts
Virology and AIDS Abstracts
Electronics & Communications Abstracts
Ceramic Abstracts
METADEX
Biotechnology and BioEngineering Abstracts
Computer and Information Systems Abstracts Professional
Solid State and Superconductivity Abstracts
Engineering Research Database
Corrosion Abstracts
DatabaseTitleList Materials Research Database

Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Xplore digital library
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
– sequence: 2
  dbid: UNPAY
  name: Unpaywall
  url: https://proxy.k.utb.cz/login?url=https://unpaywall.org/
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 1558-1578
EndPage 1955
ExternalDocumentID oai:jyx.jyu.fi:123456789/59310
10_1109_TNS_2018_2849405
8392402
Genre orig-research
GrantInformation_xml – fundername: Academy of Finland
  grantid: 2513553
  funderid: 10.13039/501100002341
– fundername: European Space Agency
  grantid: 4000111630/14/NL/PA
  funderid: 10.13039/501100000844
– fundername: National Aeronautics and Space Administration
  grantid: NNX17AD09G
  funderid: 10.13039/100000104
– fundername: NASA Goddard through the NEPP Program
GroupedDBID .DC
.GJ
0R~
29I
3O-
4.4
53G
5GY
5RE
5VS
6IK
8WZ
97E
A6W
AAJGR
AARMG
AASAJ
AAWTH
ABAZT
ABQJQ
ABVLG
ACGFO
ACGFS
ACIWK
ACNCT
ACPRK
AENEX
AETEA
AETIX
AFRAH
AGQYO
AGSQL
AHBIQ
AI.
AIBXA
AKJIK
AKQYR
ALLEH
ALMA_UNASSIGNED_HOLDINGS
ASUFR
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CS3
DU5
EBS
EJD
F5P
HZ~
H~9
IAAWW
IBMZZ
ICLAB
IDIHD
IFIPE
IFJZH
IPLJI
JAVBF
LAI
M43
MS~
O9-
OCL
P2P
RIA
RIE
RNS
TAE
TN5
VH1
VOH
AAYXX
CITATION
7QF
7QL
7QQ
7SC
7SE
7SP
7SR
7T7
7TA
7TB
7U5
7U9
8BQ
8FD
C1K
F28
FR3
H8D
H94
JG9
JQ2
KR7
L7M
L~C
L~D
M7N
P64
RIG
ADTOC
UNPAY
ID FETCH-LOGICAL-c333t-579533c348e3d33b49bb5e12c1e5f837e86d9ea26672d9d7aac78c81778a6c5b3
IEDL.DBID UNPAY
ISSN 0018-9499
1558-1578
IngestDate Sun Oct 26 04:18:16 EDT 2025
Mon Jun 30 08:37:57 EDT 2025
Wed Oct 01 04:23:58 EDT 2025
Thu Apr 24 22:54:43 EDT 2025
Wed Aug 27 02:56:19 EDT 2025
IsDoiOpenAccess false
IsOpenAccess true
IsPeerReviewed true
IsScholarly true
Issue 8
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c333t-579533c348e3d33b49bb5e12c1e5f837e86d9ea26672d9d7aac78c81778a6c5b3
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0002-0441-5444
0000-0003-0411-1835
0000-0001-7906-3669
OpenAccessLink https://proxy.k.utb.cz/login?url=http://urn.fi/URN:NBN:fi:jyu-201808203870
PQID 2090824427
PQPubID 85457
PageCount 5
ParticipantIDs proquest_journals_2090824427
crossref_citationtrail_10_1109_TNS_2018_2849405
crossref_primary_10_1109_TNS_2018_2849405
ieee_primary_8392402
unpaywall_primary_10_1109_tns_2018_2849405
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2018-08-01
PublicationDateYYYYMMDD 2018-08-01
PublicationDate_xml – month: 08
  year: 2018
  text: 2018-08-01
  day: 01
PublicationDecade 2010
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationTitle IEEE transactions on nuclear science
PublicationTitleAbbrev TNS
PublicationYear 2018
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References ref13
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ref2
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ref18
zhang (ref12) 2006
ref8
ref4
ref3
ref6
ref5
casey (ref7) 0
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References_xml – year: 2006
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– ident: ref16
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– ident: ref1
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– year: 0
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– ident: ref4
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– ident: ref5
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– ident: ref15
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– ident: ref11
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– ident: ref2
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– year: 0
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– ident: ref18
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– ident: ref3
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– ident: ref10
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– ident: ref8
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SSID ssj0014505
Score 2.5912764
Snippet Heavy ion-induced single-event burnout (SEB) is investigated in high-voltage silicon carbide power MOSFETs. Experimental data for 1200-V SiC power MOSFETs show...
SourceID unpaywall
proquest
crossref
ieee
SourceType Open Access Repository
Aggregation Database
Enrichment Source
Index Database
Publisher
StartPage 1951
SubjectTerms Burnout
Current density
Device simulations
Heavy ions
High voltages
Impact ionization
MOSFET
MOSFETs
power devices
power MOSFETs
Semiconductor process modeling
Silicon carbide
silicon carbide (SiC)
Simulation
single-event burnout (SEB)
single-event effects
TCAD
Threshold voltage
Voltage
SummonAdditionalLinks – databaseName: IEEE Electronic Library (IEL)
  dbid: RIE
  link: http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3NS8MwFH_MXdSDX1OcTunBi2K3tUmT9KhjMoRNYRvsVpo0heHshm0R_etN-sWmIp7Sw3ukzUv6e8l7eT-AKyqIwLZvmyEivqnwumty2w1NjGiQYZyQWbXPERlM8ePMmdXgtroLI6XMks9kWz9msfxgKVJ9VNbRYI515cgtykh-V6uKGGCnW7AVqAWs3PgyJNl1O5PRWOdwsbb6FbtYE9WtQVDGqbLhXm6n0cr_ePcXizWkediHYfmOeYLJSztNeFt8fivf-N-POIC9wuU07vI5cgg1GR3B7lohwgbgsWoW0uzr7EfjXiks08QYSn0teB6_xsY8MsbznvGsOdWM4dP4oT-Jj2Gqmt7ALPgUTIEQSkyH6lxSgTCTKECIY5dzR1q2sKQTqo2qZCRwpa8gm9qBG1DfF5QJZlHKfCIcjk6gHi0jeQqGVCiPObZC5T9hlwnukJA7IQ0JtxnnpAmdcog9URQb15wXCy_bdHRdTxnF00bxCqM04brSWOWFNv6QbehxreSKIW1Cq7SiV6zEWOlpUneMbdqEm8qyP7pIoniji7PfuziHHS2VZwC2oJ68pfJCeSUJv8ym4xdXotoM
  priority: 102
  providerName: IEEE
Title Single-Event Burnout Mechanisms in SiC Power MOSFETs
URI https://ieeexplore.ieee.org/document/8392402
https://www.proquest.com/docview/2090824427
http://urn.fi/URN:NBN:fi:jyu-201808203870
UnpaywallVersion submittedVersion
Volume 65
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVIEE
  databaseName: IEEE Xplore digital library
  customDbUrl:
  eissn: 1558-1578
  dateEnd: 99991231
  omitProxy: false
  ssIdentifier: ssj0014505
  issn: 0018-9499
  databaseCode: RIE
  dateStart: 19630101
  isFulltext: true
  titleUrlDefault: https://ieeexplore.ieee.org/
  providerName: IEEE
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3fS8MwED50PqgP_hanU_rgi0Ln2qRJujcnighWcQ70qTRpCtNZxbaI_vVe2m5OBMWnUkgIvbvku6OX7wPY54op6kaunRAW2YjXHVu6fmJTwuMS45Qu2T4Ddj6gF3fe3RdZNJqvjTYd3ATdoBd0k2H34b1ATzrCQBXB4JqFOeZh2t2AuUFwfXxfnbS4aWmpFYnwiFURhuH4l2THP8pTw8vtiDYexT41QnVTEFRqqnxLL-eL9CV6f4tGoymkOVuuerSykqDQNJg8totcttXHT_rGvz9iBZbqfNM6rgJkFWZ0ugaLUyyE60D7-Bhp-9S0Plo9nPBc5NalNneCh9lTZg1Tqz88sa6NoJp1edU_O73NNmCAj5NzuxZTsBUhJLc9bhpJFaFCk5gQSX0pPe24ytFeglWqFiz2dYR4zd3Yj3kUKS6UcDgXEVOeJJvQSJ9TvQWWRoinkjoJJk_UF0p6LJFewhMmXSEla8LR2L6hqpnGjeDFKCwrjo4f3gb90NgjrD3ShIPJjJeKZeOXsevGZZNxJsPDIrgJrbELw3obZjjPKLpT6vImHE7c-mMJDJBvS2z_Z_AOLJjXqimwBY38tdC7mKjkcq-8TbhXB-onwILc3w
linkProvider Unpaywall
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT8MwDLYmOAwOvAZiPHvgAqJ7NE7THmECDdgG0obErWrSVJoYHaKtEPx6krarNkCIU3qI5dZO-jmJ4w_ghAlboOVbZkhs31R43TK55YYmEhZkGCdkVu1zYHcf8faJPlXgvLwLI6XMks9kQz9mZ_nBVKR6q6ypwRx15chliog0v61VnhkgbRV8BWoKq0B-dijZcpujwVBncTkN9TN2UVPVzYFQxqqyEGBW0-jV_3j3J5M5rLleh_7sLfMUk-dGmvCG-PxWwPG_n7EBa0XQaVzko2QTKjLagtW5UoQ1wKFqJtK80vmPxqUSmKaJ0Zf6YvA4fomNcWQMxx3jQbOqGf374fXVKN6GR9V0umbBqGAKQkhiUqazSQVBR5KAEI4u51S2LdGWNFRLVenYgSt9BdrMCtyA-b5gjnDajDm-LSgnO7AUTSO5C4ZUOI8c26GKoNB1BKd2yGnIQptbDud2HZozE3uiKDeuWS8mXrbsaLmecoqnneIVTqnDaSnxmpfa-KNvTdu17FeYtA4HMy96xVyMlZymdUe0WB3OSs_-UJFE8YKKvd9VHEO1O-r3vN7N4G4fVrREng94AEvJWyoPVYyS8KNsaH4B7p3dWQ
linkToUnpaywall http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3fS8MwED50PqgP_hanU_rgi0Ln2qRJujcnighWcQ70qTRpCtNZxbaI_vVe2m5OBMWnUEgIvbvku6PX7wPY54op6kaunRAW2YjXHVu6fmJTwuMS45Qu2T4Ddj6gF3fe3RdZNJqvjTYd3ATdoBd0k2H34b1ATzrCQBXB4JqFOeZh2t2AuUFwfXxf3bR4aGmpFYnwiFURhuH4k2THP8pTw8vtiDZexT41QnVTEFRqqnxLL-eL9CV6f4tGoymkOVuuerSykqDQNJg8totcttXHT_rGv19iBZbqfNM6rgJkFWZ0ugaLUyyE60D7OIy0fWpaH60eLngucutSm3-Ch9lTZg1Tqz88sa6NoJp1edU_O73NNmCAw8m5XYsp2IoQktseN42kilChSUyIpL6UnnZc5WgvwSpVCxb7OkK85m7sxzyKFBdKOJyLiClPkk1opM-p3gJLI8RTSZ0EkyfqCyU9lkgv4QmTrpCSNeFobN9Q1UzjRvBiFJYVR8cPb4N-aOwR1h5pwsFkxUvFsvHL3HXjssk8k-FhEdyE1tiFYX0MM1xnFN0pdXkTDidu_bEFBsi3Lbb_M3kHFsxj1RTYgkb-WuhdTFRyuVeH6CeYjtve
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Single-Event+Burnout+Mechanisms+in+SiC+Power+MOSFETs&rft.jtitle=IEEE+transactions+on+nuclear+science&rft.au=Witulski%2C+Arthur+F.&rft.au=Ball%2C+Dennis+R.&rft.au=Galloway%2C+Kenneth+F.&rft.au=Javanainen%2C+Arto&rft.date=2018-08-01&rft.pub=IEEE&rft.issn=0018-9499&rft.volume=65&rft.issue=8&rft.spage=1951&rft.epage=1955&rft_id=info:doi/10.1109%2FTNS.2018.2849405&rft.externalDocID=8392402
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0018-9499&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0018-9499&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0018-9499&client=summon