Bending analysis of glass fiber reinforced epoxy composites/copper-clad laminates for multi-layer printed circuit boards

• Published in: Hybrid Advances Vol. 4; p. 100090
• Main Authors: Islam, Md Nazmul, Anwar, Md Sayed, Islam, Md Shariful, Arifuzzaman, Md, Al Bari, Md Abdullah
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.12.2023; Elsevier
• Subjects: Bending properties; Finite element analysis; Lamina thickness; Ply orientation; Printed circuit board; Printed circuit board; Lamina thickness; Ply orientation; Finite element analysis; Bending properties
• ISSN: 2773-207X; 2773-207X
• DOI: 10.1016/j.hybadv.2023.100090

Printed circuit board (PCB) is the most important part of any electronic device which is made of copper-clad laminate and glass fiber-reinforced composites. Since the ply orientation of fiber-reinforced composites and lamina thickness have a significant influence on the mechanical properties of the whole composite laminate it is necessary to investigate the effects of ply orientation and lamina thickness on the bending properties of PCB so that they can be manufactured to meet the service requirements. In this work, the bending properties of PCB were investigated for seven different ply orientations of glass fiber-reinforced composite laminas and for eight different thickness combinations (for a constant laminate thickness) of glass fiber-reinforced composite lamina and copper-clad laminate. A commercially available finite element analysis software (Abaqus) was used to simulate a three-point bending test of PCBs and the simulation results were validated using experimental results. It is found that the bending stiffness is maximum for the cross-ply laminate. The introduction of angle ply improves the maximum von-Mises stress of the PCB with an insignificant cost of bending stiffness (less than 5% reduction). It is found that the bending stiffness and the maximum von-Mises stress of the PCB can be regulated through the variation of thickness of the constituent lamina. The laminate stiffness can be increased by increasing the thickness of stiffer laminas or by placing the stiffer laminas towards the surface of the laminate. The outcome of this research would provide a comprehensive understanding of the bending characteristics of the multi-layered PCBs which can be directly utilized by the PCB manufacturers. However, the effects of ply orientation and lamina thickness variation on the behavior of the PCBs subject to temperature variation, impact loading, vibration, and other conditions that might affect the service life of the PCBs should be investigated.