APA (7th ed.) Citation

Islam, M. N., Anwar, M. S., Islam, M. S., Arifuzzaman, M., & Al Bari, M. A. (2023). Bending analysis of glass fiber reinforced epoxy composites/copper-clad laminates for multi-layer printed circuit boards. Hybrid Advances, 4, 100090. https://doi.org/10.1016/j.hybadv.2023.100090

Chicago Style (17th ed.) Citation

Islam, Md Nazmul, Md Sayed Anwar, Md Shariful Islam, Md Arifuzzaman, and Md Abdullah Al Bari. "Bending Analysis of Glass Fiber Reinforced Epoxy Composites/copper-clad Laminates for Multi-layer Printed Circuit Boards." Hybrid Advances 4 (2023): 100090. https://doi.org/10.1016/j.hybadv.2023.100090.

MLA (9th ed.) Citation

Islam, Md Nazmul, et al. "Bending Analysis of Glass Fiber Reinforced Epoxy Composites/copper-clad Laminates for Multi-layer Printed Circuit Boards." Hybrid Advances, vol. 4, 2023, p. 100090, https://doi.org/10.1016/j.hybadv.2023.100090.