High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions - Li, Shenggao; Lin, Mu-Shan; Chen, Wei-Chih; Tsai, Chien-Chun (IEEE open journal of solid-state circuits, 2024)
Keywords: 3D-IC; 3Dblox; advanced packaging; Artificial intelligence; artificial intelligence (AI) and compute; Bandwidth; chiplet integration; Chiplets; Energy efficiency; Integrated circuit interconnections; Interconnected systems; interconnects; Packaging; Signal integrity; Silicon; Thermal stresses; Three-dimensional displays; Universal Chiplets Interconnect Express (UCIe)