A 240 × 160 3D-Stacked SPAD dToF Image Sensor With Rolling Shutter and In-Pixel Histogram for Mobile Devices

A 240 <inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula> 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct time-of-flight (dToF) 3D imaging in mobile devices. Th...

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Published inIEEE open journal of solid-state circuits Vol. 2; pp. 3 - 11
Main Authors Zhang, Chao, Zhang, Ning, Ma, Zhijie, Wang, Letian, Qin, Yu, Jia, Jieyang, Zang, Kai
Format Journal Article
LanguageEnglish
Published New York IEEE 2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text
ISSN2644-1349
2644-1349
DOI10.1109/OJSSCS.2021.3118332

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Abstract A 240 <inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula> 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct time-of-flight (dToF) 3D imaging in mobile devices. The top tier is occupied by backside illuminated SPADs with 16 <inline-formula> <tex-math notation="LaTeX">\mu {\mathrm{ m}} </tex-math></inline-formula> pitch and 49.7% fill-factor. The SPADS consists of multiple 16<inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula>16 SPADs top groups, in which each of 8 <inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula> 8 SPADs sub-group shares a 10-bit, 97.65ps and 100ns range time-to-digital converter (TDC) in a quad-partition rolling shutter mode. During the exposure of each rolling stage, partial histogramming readout (PHR) approach is implemented to compress photon events to in-pixel histograms. Since the fine histograms is incomplete, for the first time we propose histogram distortion correction (HDC) algorithm to solve the linearity discontinuity at the coarse bin edges. With this algorithm, depth measurement up to 9.5m achieves an accuracy of 1cm and precision of 9mm in office lighting condition. Outdoor measurement with 10 klux sunlight achieves a maximum distance detection of 4m at 20 fps, using a VCSEL laser with the average power of 90 mW and peak power of 15 W.
AbstractList A 240 <tex-math notation="LaTeX">$\times$ </tex-math> 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct time-of-flight (dToF) 3D imaging in mobile devices. The top tier is occupied by backside illuminated SPADs with 16 <tex-math notation="LaTeX">$\mu {\mathrm{ m}}$ </tex-math> pitch and 49.7% fill-factor. The SPADS consists of multiple 16 <tex-math notation="LaTeX">$\times$ </tex-math>16 SPADs top groups, in which each of 8 <tex-math notation="LaTeX">$\times$ </tex-math> 8 SPADs sub-group shares a 10-bit, 97.65ps and 100ns range time-to-digital converter (TDC) in a quad-partition rolling shutter mode. During the exposure of each rolling stage, partial histogramming readout (PHR) approach is implemented to compress photon events to in-pixel histograms. Since the fine histograms is incomplete, for the first time we propose histogram distortion correction (HDC) algorithm to solve the linearity discontinuity at the coarse bin edges. With this algorithm, depth measurement up to 9.5m achieves an accuracy of 1cm and precision of 9mm in office lighting condition. Outdoor measurement with 10 klux sunlight achieves a maximum distance detection of 4m at 20 fps, using a VCSEL laser with the average power of 90 mW and peak power of 15 W.
A 240 <inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula> 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct time-of-flight (dToF) 3D imaging in mobile devices. The top tier is occupied by backside illuminated SPADs with 16 <inline-formula> <tex-math notation="LaTeX">\mu {\mathrm{ m}} </tex-math></inline-formula> pitch and 49.7% fill-factor. The SPADS consists of multiple 16<inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula>16 SPADs top groups, in which each of 8 <inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula> 8 SPADs sub-group shares a 10-bit, 97.65ps and 100ns range time-to-digital converter (TDC) in a quad-partition rolling shutter mode. During the exposure of each rolling stage, partial histogramming readout (PHR) approach is implemented to compress photon events to in-pixel histograms. Since the fine histograms is incomplete, for the first time we propose histogram distortion correction (HDC) algorithm to solve the linearity discontinuity at the coarse bin edges. With this algorithm, depth measurement up to 9.5m achieves an accuracy of 1cm and precision of 9mm in office lighting condition. Outdoor measurement with 10 klux sunlight achieves a maximum distance detection of 4m at 20 fps, using a VCSEL laser with the average power of 90 mW and peak power of 15 W.
A 240 [Formula Omitted] 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct time-of-flight (dToF) 3D imaging in mobile devices. The top tier is occupied by backside illuminated SPADs with 16 [Formula Omitted] pitch and 49.7% fill-factor. The SPADS consists of multiple 16[Formula Omitted]16 SPADs top groups, in which each of 8 [Formula Omitted] 8 SPADs sub-group shares a 10-bit, 97.65ps and 100ns range time-to-digital converter (TDC) in a quad-partition rolling shutter mode. During the exposure of each rolling stage, partial histogramming readout (PHR) approach is implemented to compress photon events to in-pixel histograms. Since the fine histograms is incomplete, for the first time we propose histogram distortion correction (HDC) algorithm to solve the linearity discontinuity at the coarse bin edges. With this algorithm, depth measurement up to 9.5m achieves an accuracy of 1cm and precision of 9mm in office lighting condition. Outdoor measurement with 10 klux sunlight achieves a maximum distance detection of 4m at 20 fps, using a VCSEL laser with the average power of 90 mW and peak power of 15 W.
Author Zang, Kai
Jia, Jieyang
Zhang, Chao
Ma, Zhijie
Wang, Letian
Qin, Yu
Zhang, Ning
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Snippet A 240 <inline-formula> <tex-math notation="LaTeX">\times </tex-math></inline-formula> 160 single-photon avalanche diode (SPAD) sensor integrated with a...
A 240 [Formula Omitted] 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct...
A 240 <tex-math notation="LaTeX">$\times$ </tex-math> 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is...
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SubjectTerms 3-D imaging
3-D stacking
Algorithms
Avalanche diodes
Clocks
CMOS
Converters
Depth measurement
Electronic devices
histogram
Histograms
image sensor
LIDAR
Photon avalanches
Photonics
Photons
Pixels
Power demand
Single-photon avalanche diodes
single-photon avalanche diodes (SPADs)
Three-dimensional displays
time-of-flight (dToF)
time-to-digital converter (TDC)
Vertical cavity surface emission lasers
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Title A 240 × 160 3D-Stacked SPAD dToF Image Sensor With Rolling Shutter and In-Pixel Histogram for Mobile Devices
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