APA (7th ed.) Citation

Han, J., Tan, S., & Guo, F. (2018). Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock. Journal of electronic materials, 47(1), 124-132. https://doi.org/10.1007/s11664-017-5864-3

Chicago Style (17th ed.) Citation

Han, Jing, Shihai Tan, and Fu Guo. "Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock." Journal of Electronic Materials 47, no. 1 (2018): 124-132. https://doi.org/10.1007/s11664-017-5864-3.

MLA (9th ed.) Citation

Han, Jing, et al. "Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock." Journal of Electronic Materials, vol. 47, no. 1, 2018, pp. 124-132, https://doi.org/10.1007/s11664-017-5864-3.