Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration - 蒋勐婷 刘玉岭 袁浩博 陈国栋 刘伟娟 (Journal of semiconductors, 2014)
Keywords: Abrasives; Copper; Planarization; Polishing; Semiconductors; Slurries; Tantalum; Wafers; 去除速率; 平坦化; 性能; 浆料; 消除处理; 碱性铜; 磨料浓度; 评估