Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

• Published in: Soldering & surface mount technology Vol. 36; no. 3; pp. 154 - 164
• Main Authors: Apalowo, Rilwan Kayode, Abas, Mohamad Aizat, Che Ani, Fakhrozi, Muhamed Mukhtar, Muhamed Abdul Fatah, Ramli, Mohamad Riduwan
• Format: Journal Article
• Language: English
• Published: Bradford Emerald Publishing Limited 15.05.2024; Emerald Group Publishing Limited
• Subjects: Accelerated tests; Assembly; Ball grid packaging; Cooling; Copper; Crack propagation; Edge joints; Failure analysis; Fatigue life; Fracture mechanics; Gold; Heat treating; Interfaces; Intermetallic compounds; Lead time; Life prediction; Moisture; Reliability; Scanning electron microscopy; Soldered joints; Solders; Thermal cycling; Thermal cycling tests; Thermal fatigue; Tin; Tin base alloys; Solder joint; Thermal cycling test; Reflow; Moisture; Intermetallic compound; Crack
• ISSN: 0954-0911; 0954-0911; 1758-6836
• DOI: 10.1108/SSMT-12-2023-0075

Purpose This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling. Design/methodology/approach The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method. Findings The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints. Practical implications Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism. Originality/value Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.