Thin film micro-scaled cold cathode structures of undoped and Si-doped AlN grown on SiC substrate with low turn-on voltage

The field emission characteristics of the AlN thin films with micro-scaled cold cathode structures are tested in the high vacuum system. The aluminum nitride (A1N) thin films with a thickness of about 100 nm are prepared on the n-type 6H-SiC (0001) substrate at 1100℃ by metal organic chemical vapor...

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Published inChinese physics B Vol. 24; no. 5; pp. 587 - 591
Main Author 侍铭 陈平 赵德刚 江德生 郑军 成步文 朱建军 刘宗顺 刘炜 李翔 赵丹梅 王启明 刘建平 张书明 杨辉
Format Journal Article
LanguageEnglish
Published 01.05.2015
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ISSN1674-1056
2058-3834
1741-4199
DOI10.1088/1674-1056/24/5/057901

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Abstract The field emission characteristics of the AlN thin films with micro-scaled cold cathode structures are tested in the high vacuum system. The aluminum nitride (A1N) thin films with a thickness of about 100 nm are prepared on the n-type 6H-SiC (0001) substrate at 1100℃ by metal organic chemical vapor deposition (MOCVD) under low pressure. The I-V curves and surface micro-images of undoped and Si-doped AlN films are investigated. From the I-V and Fowler-Nordheim plots, it can be seen that the Si-doped AlN shows better field emission characteristics compared with the undoped AlN sample. The obtained turn-on field is 6.7 V/μm and the maximum emission current density is 154 mA/cm2 at 69.3 V for the Si- doped AlN film cathode after proper surface treatment. It is proposed that the relatively low electric resistivity of Si-doped AlN films is significant for electron migration to the surface region, and their rougher surface morphology is beneficial to a higher local electric field enhancement for the field emission.
AbstractList The field emission characteristics of the AlN thin films with micro-scaled cold cathode structures are tested in the high vacuum system. The aluminum nitride (AlN) thin films with a thickness of about 100 nm are prepared on the n-type 6H-SiC (0001) substrate at 1100 [degres]C by metal organic chemical vapor deposition (MOCVD) under low pressure. The I-V curves and surface micro-images of undoped and Si-doped AlN films are investigated. From the I-V and Fowler-Nordheim plots, it can be seen that the Si-doped AlN shows better field emission characteristics compared with the undoped AlN sample. The obtained turn-on field is 6.7 V/ mu m and the maximum emission current density is 154 mA/cm super(2) at 69.3 V for the Si-doped AlN film cathode after proper surface treatment. It is proposed that the relatively low electric resistivity of Si-doped AlN films is significant for electron migration to the surface region, and their rougher surface morphology is beneficial to a higher local electric field enhancement for the field emission.
The field emission characteristics of the AlN thin films with micro-scaled cold cathode structures are tested in the high vacuum system. The aluminum nitride (A1N) thin films with a thickness of about 100 nm are prepared on the n-type 6H-SiC (0001) substrate at 1100℃ by metal organic chemical vapor deposition (MOCVD) under low pressure. The I-V curves and surface micro-images of undoped and Si-doped AlN films are investigated. From the I-V and Fowler-Nordheim plots, it can be seen that the Si-doped AlN shows better field emission characteristics compared with the undoped AlN sample. The obtained turn-on field is 6.7 V/μm and the maximum emission current density is 154 mA/cm2 at 69.3 V for the Si- doped AlN film cathode after proper surface treatment. It is proposed that the relatively low electric resistivity of Si-doped AlN films is significant for electron migration to the surface region, and their rougher surface morphology is beneficial to a higher local electric field enhancement for the field emission.
Author 侍铭 陈平 赵德刚 江德生 郑军 成步文 朱建军 刘宗顺 刘炜 李翔 赵丹梅 王启明 刘建平 张书明 杨辉
AuthorAffiliation State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China Key Laboratory of Nanodevices and Applications, Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Suzhou 215123, China
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CitedBy_id crossref_primary_10_1002_aisy_201900039
crossref_primary_10_7498_aps_65_236803
crossref_primary_10_1116_1_4936383
crossref_primary_10_1080_10667857_2016_1241037
crossref_primary_10_1016_j_cplett_2016_03_034
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Notes The field emission characteristics of the AlN thin films with micro-scaled cold cathode structures are tested in the high vacuum system. The aluminum nitride (A1N) thin films with a thickness of about 100 nm are prepared on the n-type 6H-SiC (0001) substrate at 1100℃ by metal organic chemical vapor deposition (MOCVD) under low pressure. The I-V curves and surface micro-images of undoped and Si-doped AlN films are investigated. From the I-V and Fowler-Nordheim plots, it can be seen that the Si-doped AlN shows better field emission characteristics compared with the undoped AlN sample. The obtained turn-on field is 6.7 V/μm and the maximum emission current density is 154 mA/cm2 at 69.3 V for the Si- doped AlN film cathode after proper surface treatment. It is proposed that the relatively low electric resistivity of Si-doped AlN films is significant for electron migration to the surface region, and their rougher surface morphology is beneficial to a higher local electric field enhancement for the field emission.
11-5639/O4
AlN, field emission, cold cathode, negative electron affinity
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Snippet The field emission characteristics of the AlN thin films with micro-scaled cold cathode structures are tested in the high vacuum system. The aluminum nitride...
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SubjectTerms 6H-SiC
AlN薄膜
Aluminum nitride
Cold cathodes
Current density
Electric fields
Field emission
Silicon carbide
Si掺杂
Thin films
Volt-ampere characteristics
场发射特性
导通电压
微尺度
金属有机化学气相沉积
阴极结构
Title Thin film micro-scaled cold cathode structures of undoped and Si-doped AlN grown on SiC substrate with low turn-on voltage
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