A composite SystemC-UVM abstract optimal path selection verification architecture for complex designs
Universal Verification Methodology (UVM) architectures are highly trained for stimulus generation and verification of System-on-chip (SoC). The cross-functional and cross-platform interactive verification is the limitation of a sole UVM architecture. Sole UVM objects are not efficient to satisfy cro...
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| Published in | Microelectronics and reliability Vol. 131; p. 114508 |
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| Main Authors | , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
01.04.2022
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| Subjects | |
| Online Access | Get full text |
| ISSN | 0026-2714 1872-941X |
| DOI | 10.1016/j.microrel.2022.114508 |
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| Abstract | Universal Verification Methodology (UVM) architectures are highly trained for stimulus generation and verification of System-on-chip (SoC). The cross-functional and cross-platform interactive verification is the limitation of a sole UVM architecture. Sole UVM objects are not efficient to satisfy cross-functional compatibility requirements. A system C verification libraries have a mechanism of introspection. The data introspection is not capable of wide cross-platform use without reusable portable accurate TLM. So a UVM module requires a SystemC block to aim for the cross-functional working of verification. The work shows a composite UVM-SystemC methodology to rationally adhere to optimal test path selection among all test paths. The work presents SC-UVM (SystemC-UVM) architecture for cross-platform working facilitation. The learning methodology works to improvise coverage parameters with the optimization of coverage bins. The methodology earns a significant contribution for early verification by reducing the internal data processing and simulation time. The SystemC-UVM method outperforms the conventional SystemVerilog and Sole UVM verification techniques. The work declares the improvement of 5.26% in simulation time with 5.11% lesser data processing for database creation in front of the sole UVM verification architecture.
•The testbench uses multi-tasking using the composite platform to ease the verification process for cross platform working.•Implementation of smart learning skill-based algorithm for optimal path selection to allow only one main scenario.•The composite SystemC-UVM testbench is for execution across IP level, block-level, and physical fabrication level. |
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| AbstractList | Universal Verification Methodology (UVM) architectures are highly trained for stimulus generation and verification of System-on-chip (SoC). The cross-functional and cross-platform interactive verification is the limitation of a sole UVM architecture. Sole UVM objects are not efficient to satisfy cross-functional compatibility requirements. A system C verification libraries have a mechanism of introspection. The data introspection is not capable of wide cross-platform use without reusable portable accurate TLM. So a UVM module requires a SystemC block to aim for the cross-functional working of verification. The work shows a composite UVM-SystemC methodology to rationally adhere to optimal test path selection among all test paths. The work presents SC-UVM (SystemC-UVM) architecture for cross-platform working facilitation. The learning methodology works to improvise coverage parameters with the optimization of coverage bins. The methodology earns a significant contribution for early verification by reducing the internal data processing and simulation time. The SystemC-UVM method outperforms the conventional SystemVerilog and Sole UVM verification techniques. The work declares the improvement of 5.26% in simulation time with 5.11% lesser data processing for database creation in front of the sole UVM verification architecture.
•The testbench uses multi-tasking using the composite platform to ease the verification process for cross platform working.•Implementation of smart learning skill-based algorithm for optimal path selection to allow only one main scenario.•The composite SystemC-UVM testbench is for execution across IP level, block-level, and physical fabrication level. |
| ArticleNumber | 114508 |
| Author | Sharma, Gaurav Bhargava, Lava Kumar, V. |
| Author_xml | – sequence: 1 givenname: Gaurav surname: Sharma fullname: Sharma, Gaurav email: gauravsharma@banasthali.in organization: Computer Science, Banasthali Vidyapith, Tonk 302044, India – sequence: 2 givenname: Lava surname: Bhargava fullname: Bhargava, Lava email: lavab@mnit.ac.in organization: MNIT, Jaipur 302017, India – sequence: 3 givenname: V. surname: Kumar fullname: Kumar, V. email: vinod.kumar_1@nxp.com organization: NXP Semiconductors, Noida, Uttar Pradesh 201301, India |
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| Cites_doi | 10.1016/j.vlsi.2020.11.013 10.1109/MDAT.2015.2427260 10.1109/TCAD.2019.2921319 10.1109/TCAD.2013.2282776 10.1109/MDAT.2016.2642898 10.1109/TCAD.2020.2974343 10.1109/ACCESS.2020.2999544 10.1166/jnn.2016.12252 10.1109/TCAD.2018.2848589 10.1109/TCAD.2020.3011039 |
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