Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips - 刘晓贤 朱樟明 杨银堂 王凤娟 丁瑞雪 (Journal of semiconductors, 2014)
Keywords: Capacitance; High speed; Interconnections; Multilevel; Reduction; Semiconductors; Signal reflection; SV通道; Three dimensional; 三维集成电路; 互连结构; 信号反射; 多级; 调谐频率; 阻抗匹配; 集成芯片