丁瑞雪, 刘. 朱. 杨. 王. (2014). Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips. Journal of semiconductors, 35(1), 121-128. https://doi.org/10.1088/1674-4926/35/1/015008
Chicago Style (17th ed.) Citation丁瑞雪, 刘晓贤 朱樟明 杨银堂 王凤娟. "Impedance Matching for the Reduction of Signal Reflection in High Speed Multilevel Three-dimensional Integrated Chips." Journal of Semiconductors 35, no. 1 (2014): 121-128. https://doi.org/10.1088/1674-4926/35/1/015008.
MLA (9th ed.) Citation丁瑞雪, 刘晓贤 朱樟明 杨银堂 王凤娟. "Impedance Matching for the Reduction of Signal Reflection in High Speed Multilevel Three-dimensional Integrated Chips." Journal of Semiconductors, vol. 35, no. 1, 2014, pp. 121-128, https://doi.org/10.1088/1674-4926/35/1/015008.