Analytical modeling of thermo-mechanical stress for bond wire of IGBT module - Dai, Xingyu; Yang, Xin; Wu, Xinlong; Tu, Chunming; Liu, Guoyou (Microelectronics and reliability, 2021)
Keywords: Bond wire; FEA simulation; IGBT module; Plastic strain; Thermo-mechanical stress; Bond wire; Thermo-mechanical stress; IGBT module; FEA simulation; Plastic strain