Preparation of a silicon micro-strip nuclear radiation detector by a two-step annealing process

The annealing process for boron implantation is a crucial step during large size nuclear radiation detector fabrication. It can reduce the lattice defects and the projection straggling. A two-step annealing process for boron implantation was developed instead of a one-step annealing process, and the...

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Published inChinese physics C Vol. 35; no. 7; pp. 635 - 637
Main Author 李海霞 李占奎 王方聪 王柱生 王秀华 李春艳
Format Journal Article
LanguageEnglish
Published 01.07.2011
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ISSN1674-1137
0254-3052
DOI10.1088/1674-1137/35/7/007

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Summary:The annealing process for boron implantation is a crucial step during large size nuclear radiation detector fabrication. It can reduce the lattice defects and the projection straggling. A two-step annealing process for boron implantation was developed instead of a one-step annealing process, and the reverse body resistance of a silicon micro-strip detector was significantly increased, which means that the performance of the detector was improved.
Bibliography:The annealing process for boron implantation is a crucial step during large size nuclear radiation detector fabrication. It can reduce the lattice defects and the projection straggling. A two-step annealing process for boron implantation was developed instead of a one-step annealing process, and the reverse body resistance of a silicon micro-strip detector was significantly increased, which means that the performance of the detector was improved.
11-5641/O4
nuclear radiation detector, two-step annealing, reverse body resistance
LI Hai-Xia LI Zhan-Kui WANG Fang-Cong WANG Zhu-Sheng WANG Xiu-Hua LI Chun-Yan( 1 Institute of Modern Physics, Chinese Academy of Science, Lanzhou 730000, China;2 Institute of Microelectronics, School of Physical Science and Technology, Lanzhou University, Lanzhou 730000, China)
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ISSN:1674-1137
0254-3052
DOI:10.1088/1674-1137/35/7/007