Fast Random Walk Based Capacitance Extraction for the 3-D IC Structures With Cylindrical Inter-Tier-Vias - Zhang, Chao; Yu, Wenjian; Wang, Qing; Shi, Yiyu (IEEE transactions on computer-aided design of integrated circuits and systems, 2015)
Keywords: Approximation methods; Capacitance; Capacitance extraction; Conductors; Electrostatics; Finite element analysis; floating random walk method; monolithic inter-tier via (MIV); three-dimensional (3D) IC; Three-dimensional displays; Through-silicon vias; Wires; capacitance extraction; monolithic inter-tier-via (MIV); floating random walk (FRW) method; 3-D integrated circuit (3-D IC); through-silicon-via (TSV)