A High-Efficiency Design Method of TSV Array for Thermal Management of 3-D Integrated System - Wang, Xianglong; Yang, Yintang; Chen, Dongdong; Li, Di (IEEE transactions on computer-aided design of integrated circuits and systems, 2023)
Keywords: Algorithms; Anisotropy; Arrays; Computational modeling; Computing time; Design techniques; Equivalent thermal conductivity (ETC); Finite element analysis; Finite element method; Integrated circuits; Interconnections; Mathematical models; Particle swarm optimization; particle swarm optimization (PSO) algorithm; Silicon; Solid modeling; Temperature gradients; Thermal conductivity; Thermal management; Three-dimensional displays; through silicon via (TSV); Through-silicon vias