APA (7th ed.) Citation

Fan, S. S., Tsai, D., & Shih, Y. (2023). Self assured Deep Learning with Minimum Pre Labeled Data for Wafer Pattern Classification. IEEE transactions on semiconductor manufacturing, 36(3), 1. https://doi.org/10.1109/TSM.2023.3276816

Chicago Style (17th ed.) Citation

Fan, Shu-Kai S., Du-Ming Tsai, and Ya-Fang Shih. "Self Assured Deep Learning with Minimum Pre Labeled Data for Wafer Pattern Classification." IEEE Transactions on Semiconductor Manufacturing 36, no. 3 (2023): 1. https://doi.org/10.1109/TSM.2023.3276816.

MLA (9th ed.) Citation

Fan, Shu-Kai S., et al. "Self Assured Deep Learning with Minimum Pre Labeled Data for Wafer Pattern Classification." IEEE Transactions on Semiconductor Manufacturing, vol. 36, no. 3, 2023, p. 1, https://doi.org/10.1109/TSM.2023.3276816.