Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm - Lu, Xiangning; He, Zhenzhi; Su, Lei; Fan, Mengying; Liu, Fan; Liao, Guanglan; Shi, Tielin (IEEE transactions on industrial informatics, 2018)
Keywords: <named-content xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" content-type="math" xlink:type="simple"> K -means clustering; Active thermography; Algorithms; Cluster analysis; Clustering; Clustering algorithms; Diagnosis; Electronic packaging; Electronic packaging thermal management; Feature extraction; Flip-chip devices; Image contrast; Image reconstruction; Inspection; Laser excitation; micro solder ball; Microelectronics; Nondestructive testing; Packaging industry; Polynomials; Temperature measurement; Test vehicles; thermal reconstruction; Thermal response; Thermography