APA (7th ed.) Citation

Lu, X., He, Z., Su, L., Fan, M., Liu, F., Liao, G., & Shi, T. (2018). Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm. IEEE transactions on industrial informatics, 14(12), 5620-5628. https://doi.org/10.1109/TII.2018.2839614

Chicago Style (17th ed.) Citation

Lu, Xiangning, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, and Tielin Shi. "Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm." IEEE Transactions on Industrial Informatics 14, no. 12 (2018): 5620-5628. https://doi.org/10.1109/TII.2018.2839614.

MLA (9th ed.) Citation

Lu, Xiangning, et al. "Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm." IEEE Transactions on Industrial Informatics, vol. 14, no. 12, 2018, pp. 5620-5628, https://doi.org/10.1109/TII.2018.2839614.