Tweedie Exponential Dispersion Processes for Degradation Modeling, Prognostic, and Accelerated Degradation Test Planning

Degradation modeling is an important method of reliability analysis for highly reliable products. The common degradation models are based on specific stochastic processes. This limits the widespread application of the modeling methods. A unified approach toward general degradation models is lacked....

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Published inIEEE transactions on reliability Vol. 69; no. 3; pp. 887 - 902
Main Authors Chen, Zhen, Xia, Tangbin, Li, Yanting, Pan, Ershun
Format Journal Article
LanguageEnglish
Published New York IEEE 01.09.2020
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN0018-9529
1558-1721
DOI10.1109/TR.2019.2955596

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Abstract Degradation modeling is an important method of reliability analysis for highly reliable products. The common degradation models are based on specific stochastic processes. This limits the widespread application of the modeling methods. A unified approach toward general degradation models is lacked. To address this issue, this article uses Tweedie exponential dispersion processes (TEDP) to establish degradation models. In such a way, the common stochastic processes turn out to be the special cases of TEDP. Then, the TEDP models can provide us more suitable models to describe the degradation paths and thereby improve the accuracy of reliability analysis. To develop the mathematical tractability of TEDP, we use the saddle-point approximation method to approximate the probability density function. Considering the unit-to-unit variability and imperfect observation, the TEDP model incorporated random effects and measurement errors are discussed. To illustrate the applicability and advantages of the TEDP models, we propose a Bayesian framework for the prognostic. A component-wise Metropolis-Hastings algorithm is developed to update the distributions of remaining useful life. Additionally, we also construct an optimization model under the constraint of budget for the accelerated degradation test planning by using TEDP. Finally, two case studies are presented to illustrate the proposed methods.
AbstractList Degradation modeling is an important method of reliability analysis for highly reliable products. The common degradation models are based on specific stochastic processes. This limits the widespread application of the modeling methods. A unified approach toward general degradation models is lacked. To address this issue, this article uses Tweedie exponential dispersion processes (TEDP) to establish degradation models. In such a way, the common stochastic processes turn out to be the special cases of TEDP. Then, the TEDP models can provide us more suitable models to describe the degradation paths and thereby improve the accuracy of reliability analysis. To develop the mathematical tractability of TEDP, we use the saddle-point approximation method to approximate the probability density function. Considering the unit-to-unit variability and imperfect observation, the TEDP model incorporated random effects and measurement errors are discussed. To illustrate the applicability and advantages of the TEDP models, we propose a Bayesian framework for the prognostic. A component-wise Metropolis–Hastings algorithm is developed to update the distributions of remaining useful life. Additionally, we also construct an optimization model under the constraint of budget for the accelerated degradation test planning by using TEDP. Finally, two case studies are presented to illustrate the proposed methods.
Author Li, Yanting
Chen, Zhen
Pan, Ershun
Xia, Tangbin
Author_xml – sequence: 1
  givenname: Zhen
  orcidid: 0000-0003-2590-0307
  surname: Chen
  fullname: Chen, Zhen
  email: chenzhendr@sjtu.edu.cn
  organization: Department of Industrial Engineering & Management, Shanghai Jiao Tong University, Shanghai, China
– sequence: 2
  givenname: Tangbin
  orcidid: 0000-0001-9121-1716
  surname: Xia
  fullname: Xia, Tangbin
  email: xtbxtb@sjtu.edu.cn
  organization: Department of Industrial Engineering & Management, Shanghai Jiao Tong University, Shanghai, China
– sequence: 3
  givenname: Yanting
  surname: Li
  fullname: Li, Yanting
  email: ytli@sjtu.edu.cn
  organization: Department of Industrial Engineering & Management, Shanghai Jiao Tong University, Shanghai, China
– sequence: 4
  givenname: Ershun
  orcidid: 0000-0001-6026-9755
  surname: Pan
  fullname: Pan, Ershun
  email: pes@sjtu.edu.cn
  organization: Department of Industrial Engineering & Management, Shanghai Jiao Tong University, Shanghai, China
BookMark eNp9kE1LAzEQhoNUsK2ePXhZ8Oq2-Wh2k2Np6wdULGU9L2kyW1LWpCZbrP_erS2CHoSBYZh55p15e6jjvAOErgkeEILlsFgOKCZyQCXnXGZnqEs4FynJKemgLsZEpJJTeYF6MW7acjSSoov2xQeAsZDM9tt2n2usqpOpjVsI0XqXLILXECPEpPIhmcI6KKOaQ-fZG6itW98dZtbOx8bqu0Q5k4y1hhqCasD8IgqITbKolXMtdonOK1VHuDrlPnq9nxWTx3T-8vA0Gc9TTYVs0hWscKZxbkgGShluMm1MxonOBWS5zLnkRGq2EiNaCapYxfSqqmSuTS41l4L10e1x7zb49117Qbnxu-BayZKOmMwxY2300fA4pYOPMUBVboN9U-GzJLg82FsWy_Jgb3mytyX4H0Lb5vvPJihb_8PdHDkLAD8qQjLavsK-AIrqiyw
CODEN IERQAD
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ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2020
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2020
DBID 97E
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
DOI 10.1109/TR.2019.2955596
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005–Present
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library (IEL)
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
DatabaseTitleList Technology Research Database

Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 1558-1721
EndPage 902
ExternalDocumentID 10_1109_TR_2019_2955596
8932595
Genre orig-research
GrantInformation_xml – fundername: National Natural Science Foundation of China
  grantid: 51475289; 51875359; 71672109
  funderid: 10.13039/501100001809
– fundername: China Postdoctoral Science Foundation
  grantid: 2019M661532
  funderid: 10.13039/501100002858
– fundername: State Key Lab of Mechanical System and Vibration program
  grantid: MSVZD201909
GroupedDBID -~X
.DC
0R~
29I
4.4
5GY
5VS
6IK
8WZ
97E
A6W
AAJGR
AARMG
AASAJ
AAWTH
ABAZT
ABQJQ
ABVLG
ACGFO
ACGFS
ACIWK
ACNCT
AENEX
AETIX
AGQYO
AGSQL
AHBIQ
AI.
AIBXA
AKJIK
AKQYR
ALLEH
ALMA_UNASSIGNED_HOLDINGS
ASUFR
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CS3
DU5
EBS
EJD
H~9
IAAWW
IBMZZ
ICLAB
IDIHD
IFIPE
IFJZH
IPLJI
JAVBF
LAI
M43
MS~
OCL
P2P
RIA
RIE
RNS
TN5
VH1
VJK
AAYXX
CITATION
7SP
8FD
L7M
ID FETCH-LOGICAL-c289t-beb06c07d16eaad5d6cdd651c78e679759519c3b842f82a3f3cbff97cd79c5983
IEDL.DBID RIE
ISSN 0018-9529
IngestDate Sun Jun 29 15:41:13 EDT 2025
Wed Oct 01 01:27:37 EDT 2025
Thu Apr 24 22:54:50 EDT 2025
Wed Aug 27 02:32:11 EDT 2025
IsPeerReviewed true
IsScholarly true
Issue 3
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
https://doi.org/10.15223/policy-029
https://doi.org/10.15223/policy-037
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c289t-beb06c07d16eaad5d6cdd651c78e679759519c3b842f82a3f3cbff97cd79c5983
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ORCID 0000-0001-6026-9755
0000-0003-2590-0307
0000-0001-9121-1716
PQID 2439703303
PQPubID 85456
PageCount 16
ParticipantIDs proquest_journals_2439703303
crossref_primary_10_1109_TR_2019_2955596
crossref_citationtrail_10_1109_TR_2019_2955596
ieee_primary_8932595
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2020-Sept.
2020-9-00
20200901
PublicationDateYYYYMMDD 2020-09-01
PublicationDate_xml – month: 09
  year: 2020
  text: 2020-Sept.
PublicationDecade 2020
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationTitle IEEE transactions on reliability
PublicationTitleAbbrev TR
PublicationYear 2020
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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SSID ssj0014498
Score 2.4188495
Snippet Degradation modeling is an important method of reliability analysis for highly reliable products. The common degradation models are based on specific...
SourceID proquest
crossref
ieee
SourceType Aggregation Database
Enrichment Source
Index Database
Publisher
StartPage 887
SubjectTerms Accelerated degradation test (ADT)
Accelerated tests
Adaptation models
Algorithms
Analytical models
Approximation
Constraint modelling
Degradation
degradation modeling
Dispersion
Optimization
Planning
Probability density functions
Reliability
Reliability analysis
remaining useful life prediction
Saddle points
Stochastic models
Stochastic processes
Tweedie exponential dispersion process (TEDP)
Title Tweedie Exponential Dispersion Processes for Degradation Modeling, Prognostic, and Accelerated Degradation Test Planning
URI https://ieeexplore.ieee.org/document/8932595
https://www.proquest.com/docview/2439703303
Volume 69
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
journalDatabaseRights – providerCode: PRVIEE
  databaseName: IEEE Electronic Library (IEL)
  customDbUrl:
  eissn: 1558-1721
  dateEnd: 99991231
  omitProxy: false
  ssIdentifier: ssj0014498
  issn: 0018-9529
  databaseCode: RIE
  dateStart: 19630101
  isFulltext: true
  titleUrlDefault: https://ieeexplore.ieee.org/
  providerName: IEEE
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LS8QwEB7Ukx58i6ur5ODBw7a2TZomx8UHIuhBKngrzaMgyiq6i-Kvd6bNLj7BWw8ZmjBJvi_JzDcAB41T1mteR9xwEwkrfYSgkEYIhbVQ3knd6hRcXsnzG3Fxm9_OwWCWC-O9b4PPfEyf7Vu-e7QTuio7QmxFtp7Pw3yhZJerNXsxEEKHXRcXcJ7pIOOTJvqovKYQLh1nOkf-LL8gUFtS5cc-3ILL2QpcTrvVxZTcx5Oxie37N8XG__Z7FZYDy2TDblqswZwfrcPSJ-3BDXgrXwm4PDt9e3ocUcwQGpzckXA4XaCxkEHgXxjSWnZCmhJd-SVG5dMoiX1AbShOD38yYPXIsaG1iGIkPuG-WJQ4ZDYtj7QJN2en5fF5FMowRBZPY-PIeJNImxQulb6uXe6kdU7mqS2Ul4UucGSpttwokTUqq3nDrWkaXVhXaJtrxbdgYYQD2QbGjURDJbiqlUhxkiA9bGRtlBS2USbvQTx1TWWDRjmVynio2rNKoqvyuiJfVsGXPTicGTx18hx_N90gz8yaBaf0oD_1fRWW70uVEU1LOML7zu9Wu7CY0cG7DTbrw8L4eeL3kJ2MzX47LT8A5n7i5Q
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Nb9QwEB2VcgAOLVAQS1vwgQOHTTaJP2Ifq7arBbo9rLJSb1H8EakCbSu6Kyp-PTOJd9VSKnHLwaPYGtvv2Z55A_Cp9doFw5uEW24T4VRIEBTyBKGwETp4ZTqdgum5mszF1wt5sQXDTS5MCKELPgspfXZv-f7KreiqbITYimxdPoGnUggh-2ytzZuBECbuu7iEZWGikE-emVE1oyAukxZGIoNW9zCoK6ryYCfu4GW8C9N1x_qoku_pamlT9_svzcb_7flL2Ik8kx31E-MVbIXFa3hxR31wD26rXwRdgZ3eXl8tKGoIDU4uSTqcrtBYzCEINwyJLTshVYm-ABOjAmqUxj6kNhSphz8Zsmbh2ZFziGMkP-HvWVQ4ZLYukPQG5uPT6niSxEIMicPz2DKxwWbKZaXPVWgaL71y3iuZu1IHVZoSR5Ybx60WRauLhrfc2bY1pfOlcdJo_ha2FziQd8C4VWioBdeNFjlOEySIrWqsVsK12soBpGvX1C6qlFOxjB91d1rJTF3NavJlHX05gM8bg-teoOPxpnvkmU2z6JQBHKx9X8cFfFMXRNQyjgD__t9WH-HZpJqe1Wdfzr_tw_OCjuFd6NkBbC9_rsIhcpWl_dBN0T_sQuYy
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Tweedie+Exponential+Dispersion+Processes+for+Degradation+Modeling%2C+Prognostic%2C+and+Accelerated+Degradation+Test+Planning&rft.jtitle=IEEE+transactions+on+reliability&rft.au=Chen%2C+Zhen&rft.au=Xia%2C+Tangbin&rft.au=Li%2C+Yanting&rft.au=Pan%2C+Ershun&rft.date=2020-09-01&rft.pub=The+Institute+of+Electrical+and+Electronics+Engineers%2C+Inc.+%28IEEE%29&rft.issn=0018-9529&rft.eissn=1558-1721&rft.volume=69&rft.issue=3&rft.spage=887&rft_id=info:doi/10.1109%2FTR.2019.2955596&rft.externalDBID=NO_FULL_TEXT
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0018-9529&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0018-9529&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0018-9529&client=summon