Imaging and Characteristics of a Bimaterial Microcantilever FPA Fabricated using Bulk Silicon Processes

For a focal plane array (FPA) fabricated with a surface sacrificial layer process, the IR flux must transmit through the silicon substrate and the air gap before it reaches the cantilever pixels. Part of the IR radiation energy is therefore lost owing to the reflection and absorption caused by the s...

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Published inChinese physics letters Vol. 29; no. 5; pp. 58502 - 1-058502-4
Main Authors Zhao, An-Di, Zheng, Yong-Jun, Yu, Xiao-Mei
Format Journal Article
LanguageEnglish
Published 01.05.2012
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ISSN0256-307X
1741-3540
DOI10.1088/0256-307X/29/5/058502

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Abstract For a focal plane array (FPA) fabricated with a surface sacrificial layer process, the IR flux must transmit through the silicon substrate and the air gap before it reaches the cantilever pixels. Part of the IR radiation energy is therefore lost owing to the reflection and absorption caused by the silicon substrate. We fabricate an infrared FPA consisting of 128128 microcantilever pixels by using a novel bulk micro-electro-mechanical-system process. Thermal images of persons at room temperature are captured to demonstrate the IR imaging capability of the FPA. For the proposed device, the thermal response is calculated to be 4.03 x 10 super(-)3 the thermo-mechanical sensitivity is measured to be 0.273 mu m/K, the noise equivalent temperature difference is measured to be 200mK by a gray level change method and the time constant is calculated to be 15 ms under a 10mTorr pressure.
AbstractList For a focal plane array (FPA) fabricated with a surface sacrificial layer process, the IR flux must transmit through the silicon substrate and the air gap before it reaches the cantilever pixels. Part of the IR radiation energy is therefore lost owing to the reflection and absorption caused by the silicon substrate. We fabricate an infrared FPA consisting of 128128 microcantilever pixels by using a novel bulk micro-electro-mechanical-system process. Thermal images of persons at room temperature are captured to demonstrate the IR imaging capability of the FPA. For the proposed device, the thermal response is calculated to be 4.03 x 10 super(-)3 the thermo-mechanical sensitivity is measured to be 0.273 mu m/K, the noise equivalent temperature difference is measured to be 200mK by a gray level change method and the time constant is calculated to be 15 ms under a 10mTorr pressure.
Author Yu, Xiao-Mei
Zhao, An-Di
Zheng, Yong-Jun
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CitedBy_id crossref_primary_10_1016_j_mspro_2015_06_076
crossref_primary_10_1109_JMEMS_2016_2533427
crossref_primary_10_1007_s00542_013_1854_4
crossref_primary_10_1088_0256_307X_30_10_100701
Cites_doi 10.1063/1.2959574
10.1063/1.1667257
10.1117/12.718785
10.1063/1.2337083
10.1088/0960-1317/18/5/057001
10.1016/j.sna.2009.08.009
10.1117/12.664727
10.1117/12.786633
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Snippet For a focal plane array (FPA) fabricated with a surface sacrificial layer process, the IR flux must transmit through the silicon substrate and the air gap...
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StartPage 58502
SubjectTerms Focal plane
Imaging
Infrared
Mathematical analysis
Noise equivalent temperature difference
Pixels
Silicon substrates
Thermal response
Title Imaging and Characteristics of a Bimaterial Microcantilever FPA Fabricated using Bulk Silicon Processes
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