Thermoelectric high-entropy alloys with low lattice thermal conductivity
Reducing lattice thermal conductivity is one of the most effective routes for improving the performance of thermoelectric materials. Herein, a novel alloy design concept, i.e. , the high-entropy alloy concept, is introduced as a new strategy to reduce lattice thermal conductivity and the BiSbTe 1.5...
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| Published in | RSC advances Vol. 6; no. 57; pp. 52164 - 5217 |
|---|---|
| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
| Published |
01.01.2016
|
| Subjects | |
| Online Access | Get full text |
| ISSN | 2046-2069 2046-2069 |
| DOI | 10.1039/c5ra28088e |
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| Summary: | Reducing lattice thermal conductivity is one of the most effective routes for improving the performance of thermoelectric materials. Herein, a novel alloy design concept,
i.e.
, the high-entropy alloy concept, is introduced as a new strategy to reduce lattice thermal conductivity and the BiSbTe
1.5
Se
1.5
high-entropy alloy was chosen as a paradigm to demonstrate the applicability of this new approach. It was found that the lattice thermal conductivity of this high-entropy alloy is quite low,
i.e.
, 0.47 W m
1
K
1
at 400 K, which results from its severe lattice-distortion. In addition, the minor addition of Ag could improve the absolute value of its Seebeck coefficient and further reduce its lattice thermal conductivity. Consequently, a peak ZT value of 0.63 was observed at 450 K for this alloy with the addition of 0.9 at% Ag. Our current results suggest that the revolutionary alloy design concept is a promising strategy for developing novel thermoelectric materials with desirable properties.
Reducing lattice thermal conductivity is one of the most effective routes for improving the performance of thermoelectric materials. |
|---|---|
| Bibliography: | Electronic supplementary information (ESI) available. See DOI 10.1039/c5ra28088e ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
| ISSN: | 2046-2069 2046-2069 |
| DOI: | 10.1039/c5ra28088e |