APA (7th ed.) Citation

Tan, X., Tao, Z., Li, H., Xu, T., & Yu, M. (2018). A quality quantitative method of silicon direct bonding based on wavelet image analysis. Journal of micromechanics and microengineering, 28(4), 45008-45021. https://doi.org/10.1088/1361-6439/aaac5e

Chicago Style (17th ed.) Citation

Tan, Xiao, Zhi Tao, Haiwang Li, Tiantong Xu, and Mingxing Yu. "A Quality Quantitative Method of Silicon Direct Bonding Based on Wavelet Image Analysis." Journal of Micromechanics and Microengineering 28, no. 4 (2018): 45008-45021. https://doi.org/10.1088/1361-6439/aaac5e.

MLA (9th ed.) Citation

Tan, Xiao, et al. "A Quality Quantitative Method of Silicon Direct Bonding Based on Wavelet Image Analysis." Journal of Micromechanics and Microengineering, vol. 28, no. 4, 2018, pp. 45008-45021, https://doi.org/10.1088/1361-6439/aaac5e.