Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method - Cook, Chase; Sun, Zeyu; Demircan, Ertugrul; Shroff, Mehul D.; Tan, Sheldon X.-D. (IEEE transactions on very large scale integration (VLSI) systems, 2018)
Keywords: Current density; Integrated circuit interconnections; integrated circuit reliability; Mathematical model; Stress; Time-domain analysis; Very large scale integration; Wires