Novel Spare TSV Deployment for 3-D ICs Considering Yield and Timing Constraints - Chen, Yu-Guang; Wen, Wan-Yu; Shi, Yiyu; Hon, Wing-Kai; Chang, Shih-Chieh (IEEE transactions on computer-aided design of integrated circuits and systems, 2015)
Keywords: 3D IC; Fault tolerance; Fault tolerant systems; Integrated circuit reliability; Reliability; Routing; Three-dimensional displays; Through-silicon vias; Timing; TSV; Fault-tolerance; three dimensional integrated circuits (3-D IC); through silicon via (TSV); reliability