Next generation barrier CMP slurry with novel weakly alkaline chelating agent - 樊世燕 刘玉岭 孙鸣 唐继英 闫辰奇 李海龙 王胜利 (Journal of semiconductors, 2015)
Keywords: Barriers; Chelating; CMP; Copper; Devices; Polishing; Semiconductors; Slurries; Wafers; 低k电介质; 弱碱性; 泥浆; 研磨速度; 螯合剂; 表面粗糙度; 阻挡层