Additive electronics manufacturing of embedded RF die packaging and multi-chip phased array module - Obeidat, Abdullah S.; Umar, Ashraf; Al-Haidari, Riadh; Alshaibani, W.T.; Dou, Zhi; Alshatnawi, Firas; Gonya, Stephen; Poliks, Mark D.; Hoel, Cathleen; Boyd, Linda; Bellows, Charles; Soto-Valle, Genaro; et al. (Journal of manufacturing processes, 2025)
Keywords: 3D printed ceramic; Additive electronics; Aerosol jet printing; Embedded electronics; Multi-chip module; Radio frequency; Radio frequency; Additive electronics; Embedded electronics; 3D printed ceramic; Multi-chip module; Aerosol jet printing