APA (7th ed.) Citation

Obeidat, A. S., Umar, A., Al-Haidari, R., Alshaibani, W., Dou, Z., Alshatnawi, F., . . . Pavinatto, F. (2025). Additive electronics manufacturing of embedded RF die packaging and multi-chip phased array module. Journal of manufacturing processes, 148, 408-425. https://doi.org/10.1016/j.jmapro.2025.05.032

Chicago Style (17th ed.) Citation

Obeidat, Abdullah S., et al. "Additive Electronics Manufacturing of Embedded RF Die Packaging and Multi-chip Phased Array Module." Journal of Manufacturing Processes 148 (2025): 408-425. https://doi.org/10.1016/j.jmapro.2025.05.032.

MLA (9th ed.) Citation

Obeidat, Abdullah S., et al. "Additive Electronics Manufacturing of Embedded RF Die Packaging and Multi-chip Phased Array Module." Journal of Manufacturing Processes, vol. 148, 2025, pp. 408-425, https://doi.org/10.1016/j.jmapro.2025.05.032.