Investigation of Creep Failure in Ag-4Pd Bonding Wire under Dynamic Mechanical Analysis Tests

Ag-alloy wire is of particular interest in high power integrated circuits (ICs) due to its superior physical properties, but studies on creep failure in Ag-alloy wire are extremely sparse. This paper investigated the creep behavior of the widely used Ag-4Pd bonding wire at tensile stress levels of 2...

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Published inIEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 13; no. 12; p. 1
Main Authors Chen, Chun-Hao, Chiang, Meng-Ting, Chuang, Tung-Han
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 01.12.2023
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Ag-alloy bonding wire
Arrhenius power-law creep
Bonding
Creep
Creep strength
Deformation
Diffusion rate
Dislocation mobility
Dynamic mechanical analysis
Equilibrium flow
failure analysis
Grain boundaries
Integrated circuits
Metal-metal bonding
Packaging
Physical properties
Power integrated circuits
Reliability
Steady state creep
Tensile stress
Wire
Wires
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ISSN2156-3950
2156-3985
DOI10.1109/TCPMT.2023.3336639

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Abstract Ag-alloy wire is of particular interest in high power integrated circuits (ICs) due to its superior physical properties, but studies on creep failure in Ag-alloy wire are extremely sparse. This paper investigated the creep behavior of the widely used Ag-4Pd bonding wire at tensile stress levels of 20-80 MPa at constant temperature and in the temperature range of 300 °C to 400 °C at constant tensile stress. The steady-state creep flow behavior was analyzed through fitting of the Arrhenius power-law creep equation, and the rate-dependent process of creep deformation was found to be dislocation climb-controlled. The activation energy of creep in Ag-4Pd bonding wire is 133.86 kJ/mol within this temperature range, suggesting that fast diffusion paths could be involved. Results of cross-sectional analysis of the brittle fractured wire correlate with the kinetic analysis from a phenomenological point of view, indicating diffusion paths through grain boundaries.
AbstractList Ag-alloy wire is of particular interest in high-power integrated circuits (ICs) due to its superior physical properties, but studies on creep failure in Ag-alloy wire are extremely sparse. This article investigated the creep behavior of the widely used Ag-4Pd bonding wire at tensile stress levels of 20–80 MPa at constant temperature and in the temperature range of 300 °C–400 °C at constant tensile stress. The steady-state creep flow behavior was analyzed through fitting the Arrhenius power-law creep equation, and the rate-dependent process of creep deformation was found to be dislocation climb-controlled. The activation energy of creep in Ag-4Pd bonding wire is 133.86 kJ/mol within this temperature range, suggesting that fast diffusion paths could be involved. Results of the cross-sectional analysis of the brittle fractured wire correlate with the kinetic analysis from a phenomenological point of view, indicating diffusion paths through grain boundaries.
Ag-alloy wire is of particular interest in high power integrated circuits (ICs) due to its superior physical properties, but studies on creep failure in Ag-alloy wire are extremely sparse. This paper investigated the creep behavior of the widely used Ag-4Pd bonding wire at tensile stress levels of 20-80 MPa at constant temperature and in the temperature range of 300 °C to 400 °C at constant tensile stress. The steady-state creep flow behavior was analyzed through fitting of the Arrhenius power-law creep equation, and the rate-dependent process of creep deformation was found to be dislocation climb-controlled. The activation energy of creep in Ag-4Pd bonding wire is 133.86 kJ/mol within this temperature range, suggesting that fast diffusion paths could be involved. Results of cross-sectional analysis of the brittle fractured wire correlate with the kinetic analysis from a phenomenological point of view, indicating diffusion paths through grain boundaries.
Author Chiang, Meng-Ting
Chen, Chun-Hao
Chuang, Tung-Han
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Snippet Ag-alloy wire is of particular interest in high power integrated circuits (ICs) due to its superior physical properties, but studies on creep failure in...
Ag-alloy wire is of particular interest in high-power integrated circuits (ICs) due to its superior physical properties, but studies on creep failure in...
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SubjectTerms Ag-alloy bonding wire
Arrhenius power-law creep
Bonding
Creep
Creep strength
Deformation
Diffusion rate
Dislocation mobility
Dynamic mechanical analysis
Equilibrium flow
failure analysis
Grain boundaries
Integrated circuits
Metal-metal bonding
Packaging
Physical properties
Power integrated circuits
Reliability
Steady state creep
Tensile stress
Wire
Wires
Title Investigation of Creep Failure in Ag-4Pd Bonding Wire under Dynamic Mechanical Analysis Tests
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