Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets - Janabi, Ameer; Shillaber, Luke; Ying, Wucheng; Mu, Wei; Hu, Borong; Jiang, Yunlei; Iosifidis, Nikolaos; Ran, Li; Long, Teng (IEEE transactions on power electronics, 2024)
Keywords: Advanced packaging of power electronics; Circuit boards; Copper; Design standards; Electrical insulation; Electrical resistivity; Electronic packaging; embedded die; Etching; Inductance; integrated power electronics; Logic gates; Printed circuits; Silicon carbide; standard cell; Substrates; Thermal conductivity